Photonic module integration based on silicon, ceramic and plastic technologies
Espoo : VTT Technical Research Centre of Finland,
|Publish Date:|| 2008-11-06
|Thesis type:||Doctoral Dissertation
|Defence Note:||Academic dissertation for the degree of Doctor of Technology to be presented, with the permission of the Department of Electrical Engineering of the University of Oulu, for public discussion in the Auditorium L6, Linnanmaa, on November 14th, at 12 o´clock noon.
This thesis reports the main results in photonic module integration using silicon, multilayer ceramic and plastic technologies.
In order to implement high-performance photonic modules the accurate alignment between critical devices and components is very essential. Cost-efficient photonic modules in volume production can be achieved, when the alignment of devices and components is implemented passively. Utilization of lithographic manufacturing process in silicon processing ensures that the required alignment tolerances between devices are well possible to achieve with photonic modules. The capability of silicon technology to produce a monolithically integrated photonic sensor system, a miniaturized infrared (IR) spectrometer, is studied and evaluated in this work.
The capability of a multilayer ceramics substrate to act as an optical platform for a miniature profilometer and an optical bench for passive alignment of laser chip and fiber is evaluated. The components of the miniature profilometer are aligned below +/- 100 μm transverse tolerance passively, which enables operational sensor module implementation. The multilayer ceramic optical bench substrate demonstrates transverse passive alignment tolerances of 3 … 0 μm in laser-to-fiber coupling. The tolerances are at adequate level for multimode couplings, but inadequate for single-mode couplings.
Transverse alignment tolerances below +/-60 μm are achieved between source and lens surface using in-mold integration with a novel VCSEL illuminator. In addition, a fully operational microscope lens system for Nokia 6630 mobile phone using in-mold integration is designed, implemented and evaluated.