Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?
|Author:||Roshni, Satheesh Babu1; Sebastian, Mailadil Thomas2; Surendran, Kuzhichalil Peethambharan1|
1Materials Science and Technology Division, National Institute for Interdisciplinary Science and Technology, CSIR, Trivandrum 695019, India
2Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, 90014, Finland
|Online Access:||PDF Full Text (PDF, 1.7 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe201703315927
Nature Publishing Group,
|Publish Date:|| 2017-03-31
Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK−1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK−1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm−1K−1 (thermal conductivity of alumina is about 24.5 Wm−1K−1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
216 Materials engineering
Authors are grateful for the financial support from Department of Science and Technology, Government of India,
New Delhi (Ref: DST/TSG/NTS/2012/89).
© The Author(s) 2017. This work is licensed under a Creative Commons Attribution 4.0 International License. The images
or other third party material in this article are included in the article’s Creative Commons license,
unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license,
users will need to obtain permission from the license holder to reproduce the material. To view a copy of this
license, visit http://creativecommons.org/licenses/by/4.0/