University of Oulu

Roshni, S. B. et al. Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate? Sci. Rep. 7, 40839; doi: 10.1038/srep40839 (2017).

Can zinc aluminate-titania composite be an alternative for alumina as microelectronic substrate?

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Author: Roshni, Satheesh Babu1; Sebastian, Mailadil Thomas2; Surendran, Kuzhichalil Peethambharan1
Organizations: 1Materials Science and Technology Division, National Institute for Interdisciplinary Science and Technology, CSIR, Trivandrum 695019, India
2Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, 90014, Finland
Format: article
Version: published version
Access: open
Online Access: PDF Full Text (PDF, 1.7 MB)
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Language: English
Published: Springer Nature, 2017
Publish Date: 2017-03-31


Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK⁻¹). The present paper explores the potentiality of a ceramic composite 0.83ZnAl₂O₄-0.17TiO₂ (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK⁻¹ and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm⁻¹K⁻¹ (thermal conductivity of alumina is about 24.5 Wm⁻¹K⁻¹), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.

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Series: Scientific reports
ISSN: 2045-2322
ISSN-E: 2045-2322
ISSN-L: 2045-2322
Volume: 7
Article number: 40839
DOI: 10.1038/srep40839
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
Funding: Authors are grateful for the financial support from Department of Science and Technology, Government of India, New Delhi (Ref: DST/TSG/NTS/2012/89).
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