BaTiO₃–P(VDF-TrFE) composite ink properties for printed decoupling capacitors |
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Author: | Siponkoski, Tuomo1; Nelo, Mikko1; Peräntie, Jani1; |
Organizations: |
1Microelectronics and Materials Physics Laboratories, University of Oulu, BOX 4500, FI-90014, Finland |
Format: | article |
Version: | accepted version |
Access: | open |
Online Access: | PDF Full Text (PDF, 0.6 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe201706197369 |
Language: | English |
Published: |
Elsevier,
2015
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Publish Date: | 2017-03-01 |
Description: |
AbstractIn this research a composite for printable capacitors using screen printed structures and low temperature curing ferroelectric ink was investigated. The realized ink consisted of 40 vol% barium titanate in a poly(vinylidenefluoride-trifluoroethylene) matrix. DuPont silver ink 5064H was used for the conductive lines in the design and the maximum process temperature was 130 °C. The thickness of the composite and the area of the printed capacitor were 43 μm and area 25 mm², respectively. The obtained relative permittivity of the composite was 46 and the tan δ was 0.15 at 1 MHz. Additionally, the microstructure of the composite was investigated and the temperature dependence of the dielectric properties measured. The capacitance of the parallel plate structure was approximately 200 pF at 1 MHz. This is easily adjustable by changing the printing pattern, number of layers or the filler loading. The freedom of choice in integration and capacitance value selection makes the ink highly usable in, for example, decoupling capacitors that are compatible with inorganic, organic and even flexible, substrates. see all
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Series: |
Composites. Part B, Engineering |
ISSN: | 1359-8368 |
ISSN-E: | 1879-1069 |
ISSN-L: | 1359-8368 |
Volume: | 70 |
Pages: | 201 - 205 |
Article number: | S1359836814005290 |
DOI: | 10.1016/j.compositesb.2014.11.017 |
OADOI: | https://oadoi.org/10.1016/j.compositesb.2014.11.017 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
213 Electronic, automation and communications engineering, electronics 216 Materials engineering |
Subjects: | |
Funding: |
The authors acknowledge Tekes funded Project “Innoinks” 906/31/2010 and its co-partners: Jozef Stefan Institute (Slovenia), ITME (Poland), Sachtleben Pigments Oy (Finland), Pulse Finland Oy (Finland) and NOF Corporation (Japan) for supporting this study. Authors T. S. and M. N. appreciatively acknowledge the Riitta ja Jorma J. Takanen foundation and Infotech Oulu Doctoral Program for funding. Author M. N. acknowledges also KAUTE, Tauno Tönning and Wihuri foundations for financial support. Author J. J. gratefully acknowledges Academy of Finland funding (grant agreement No. 267573). |
Academy of Finland Grant Number: |
267573 |
Detailed Information: |
267573 (Academy of Finland Funding decision) |
Copyright information: |
Copyright © 2014 Elsevier Ltd. All rights reserved. |
https://creativecommons.org/licenses/by-nc-nd/4.0/ |