University of Oulu

Tolvanen, J., Hannu, J., Juuti, J. et al. Electron. Mater. Lett. (2018) 14: 113.

Piezoelectric flexible LCP–PZT composites for sensor applications at elevated temperatures

Saved in:
Author: Tolvanen, Jarkko1; Hannu, Jari1; Juuti, Jari1;
Organizations: 1Microelectronics Research Unit, University of Oulu, 90014 Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.8 MB)
Persistent link:
Language: English
Published: Springer Nature, 2018
Publish Date: 2019-03-03


In this paper fabrication of piezoelectric ceramic–polymer composites is demonstrated via filament extrusion enabling cost-efficient large-scale production of highly bendable pressure sensors feasible for elevated temperatures. These composites are fabricated by utilizing environmentally resistant and stable liquid crystal polymer matrix with addition of lead zirconate titanate at loading levels of 30 vol%. These composites, of approximately 0.99 mm thick and length of  > 50 cm, achieved excellent bendability with minimum bending radius of ~ 6.6 cm. The maximum piezoelectric coefficients d₃₃ and g₃₃ of the composites were > 14 pC/N and > 108 mVm/N at pressure < 10 kPa. In all cases, the piezoelectric charge coefficient (d₃₃) of the composites decreased as a function of pressure. Also, piezoelectric coefficient (d₃₃) further decreased in the case of increased frequency press-release cycle sand pre-stress levels by approximately 37–50%. However, the obtained results provide tools for fabricating novel piezoelectric sensors in highly efficient way for environments with elevated temperatures.

see all

Series: Electronic materials letters
ISSN: 1738-8090
ISSN-E: 2093-6788
ISSN-L: 1738-8090
Volume: 14
Issue: 2
Pages: 113 - 123
DOI: 10.1007/s13391-018-0027-0
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: Financial support of the Hybrid materials project (2105/31/2013) of Tekes program of the Finnish Metals and Engineering Competence Cluster (FIMECC Ltd) is gratefully acknowledged. Author J.J. acknowledges the funding of the Academy of Finland (project numbers 267573). Author JT was supported by Riitta and Jorma J. Takanen Foundation, Walter Ahlström Foundation, Tauno Tönning Foundation, and Finnish Foundation for Technology Promotion.
Academy of Finland Grant Number: 267573
Detailed Information: 267573 (Academy of Finland Funding decision)
Copyright information: © The Korean Institute of Metals and Materials 2018. This is a post-peer-review, pre-copyedit version of an article published in Electronic Materials Letters. The final authenticated version is available online at: