University of Oulu

V. Niemelä, J. Haapola, M. Hämäläinen and J. Iinatti, "An Ultra Wideband Survey: Global Regulations and Impulse Radio Research Based on Standards," in IEEE Communications Surveys & Tutorials, vol. 19, no. 2, pp. 874-890, Secondquarter 2017. doi: 10.1109/COMST.2016.2634593

An ultra wideband survey : global regulations and impulse radio research based on standards

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Author: Niemelä, Ville1; Haapola, Jussi1; Hämäläinen, Matti1;
Organizations: 1Centre for Wireless Communications, University of Oulu
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2018062726514
Language: English
Published: Institute of Electrical and Electronics Engineers, 2017
Publish Date: 2018-06-27
Description:

Abstract

This paper presents an updated survey on research related to ultra wideband (UWB) communications, particularly that of impulse radio (IR) technology. In addition to the research, we survey UWB physical layer specifications of the two existing standards-the IEEE 802.15.6-2012 and the IEEE 802.15.4-2015-as well as the leading global UWB spectrum regulatory limitations which have been updated recently. The latter standard including the UWB specifications was first published in 2007 and the latest revision dates to 2015. The focus in this paper is the period from 2007 to 2015. Our purpose is to provide an in-depth survey with a clearly specified topic together with the standard specifications and the related regulatory restrictions. Additionally, the last part of this paper discusses the possibilities of increasing the current IR-UWB data rates to meet increasing future demands.

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Series: IEEE communications surveys and tutorials
ISSN: 1553-877X
ISSN-E: 2373-745X
ISSN-L: 1553-877X
Volume: 19
Issue: 2
Pages: 874 - 890
DOI: 10.1109/COMST.2016.2634593
OADOI: https://oadoi.org/10.1109/COMST.2016.2634593
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
Funding: This work was supported in part by the Finnish Funding Agency for Innovation (Tekes) within the project EWiHS and the Academy of Finland within the project DWHN.
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