V. Tapio, M. Juntti, A. Pärssinen and K. Rikkinen, "Real time adaptive RF and digital self-interference cancellation for full-duplex transceivers," 2016 50th Asilomar Conference on Signals, Systems and Computers, Pacific Grove, CA, 2016, pp. 1558-1562. doi: 10.1109/ACSSC.2016.7869640
Real time adaptive RF and digital self-interference cancellation for full-duplex transceivers
|Author:||Tapio, Visa1; Juntti, Markku1; Pärssinen, Aarno1;|
1Centre for Wireless Communications University of Oulu, Finland
|Online Access:||PDF Full Text (PDF, 1.7 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2018062926689
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2018-06-29
The challenges with full-duplex (FD) transceiver implementation and transmission in small area radio communication systems are considered. The main challenge in the FD transceiver design is the self-interference (SI). Analog and digital SI cancellation is used for SI mitigation. Analog SI isolation is performed at radio frequency (RF) by utilizing an antenna design based on the characteristic modes theory and using active cancellation principle. Phase and attenuation values of the active cancellation signal path are tuned using a variable-step steepest descent algorithm while transmitting a data signal to a distant node in foil-duplex mode. After the tuning, the SI isolation at RF processing is 90 dB. The remaining SI is then cancelled at the baseband processing for which the an estimate of the SI channel is needed. The SI channel estimation is done in full-duplex mode. Because the receiver has full knowledge of the transmitted signal, no extra pilots are used for the SI cancellation.
Asilomar Conference on Signals, Systems & Computers
|Pages:||1558 - 1562|
50th Asilomar Conference on Signals, Systems, and Computers, 6 – 9 November 2016, Pacific Grove, USA
Asilomar Conference on Signals, Systems, and Computers
|Type of Publication:||
A4 Article in conference proceedings
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
This work has been funded by Tekes-the Finnish Funding Agency for Innovation, Nokia Oyj, Esju Oy and CoreHW Oy.
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