Vitaly Petrov, Joonas Kokkoniemi, Dmitri Moltchanov, Janne Lehtomäki, Yevgeni Koucheryavy, Enabling simultaneous cooling and data transmission in the terahertz band for board-to-board communications, Physical Communication, Volume 22, 2017, Pages 9-18, ISSN 1874-4907, https://doi.org/10.1016/j.phycom.2016.11.002
Enabling simultaneous cooling and data transmission in the terahertz band for board-to-board communications
|Author:||Petrov, Vitaly1; Kokkoniemi, Joonas2; Moltchanov, Dmitri1;|
1Department of Electronics and Communications Engineering, Tampere University of Technology, Tampere, Finland
2Centre for Wireless Communications, University of Oulu, Finland
|Online Access:||PDF Full Text (PDF, 4.2 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2018080933558
|Publish Date:|| 2018-08-09
A system enabling simultaneous cooling and board-to-board communications is proposed and analyzed. It is shown that hollow pipes used in computer cooling systems can be applied for communications with extreme data rates at distances up to tens of centimeters. This is done by using wireless communications in the terahertz frequency band, 0.1–10 THz. The experiments were performed in order to observe how straight and curved pipes of different diameters and lengths affect THz signals propagating inside the pipes. The measured pulses were recorded and used in numerical evaluation of bit error rate and throughput taking into account the effect of all possible combinations of N previous symbols. The numerical results show the dependency of the intersymbol interference on the delay profile of the channel and on the symbol period. The results demonstrate that even with simple on–off keying modulation the throughput reaches few terabits per second with qualitatively low bit error rates. This enables communications between rate-hungry electronics inside computers such as central and graphical processing units while simultaneously providing the cooling functionality.
|Pages:||9 - 18|
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
This work was supported by Infotech Oulu, Academy of Finland SeCoFu project, Academy of Finland FiDiPro program "Nanocommunication Networks" 2012 - 2016, and Nokia Foundation.
© 2016. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/