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E. Sankila, V. Kiuru, J. Aikio and T. Rahkonen, "Building Lumped Models for Measured Passive mm-wave Components," 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC), Tallinn, 2018, pp. 1-4. doi: 10.1109/NORCHIP.2018.8573484

Building lumped models for measured passive mm-wave components

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Author: Sankila, Eero1; Kiuru, Veeti1; Aikio, Janne1;
Organizations: 1University of Oulu Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1.8 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe201902074303
Language: English
Published: Institute of Electrical and Electronics Engineers, 2018
Publish Date: 2019-02-07
Description:

Abstract

This paper presents a synthesis flow for building lumped circuit models of arbitrary complexity for mm-wave IC passive components, based on S-parameters obtained by measurements or electromagnetic (EM) field simulations. Lumped circuit models are needed in time-domain simulations, or to speed up the fine-tuning of passive circuit blocks, as iterating is much faster in circuit simulators than in EM simulator. Modeling algorithm is implemented in MATLAB, and the design flow has a few new features. The device model is given by Spice netlist, and its structure or complexity is not limited. Differential and common mode forms of admittance parameters are used to simplify solving the initial model component values that are then refined manually or by numerical optimization. The flow is illustrated by modeling a parallel LC resonator, whose response has been measured from 1 to 40 GHz

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ISBN: 978-1-5386-7656-1
ISBN Print: 978-1-5386-7657-8
DOI: 10.1109/NORCHIP.2018.8573484
OADOI: https://oadoi.org/10.1109/NORCHIP.2018.8573484
Host publication: 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC)
Conference: IEEE Nordic Circuits and Systems Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
buildings
inductors
integrated circuit modeling
layout
numerical models
scattering parameters
transmission line measurements
Article
Funding: This research has been financially supported by Academy of Finland 6Genesis Flagship (grant 318927) and Nokia Corporation Ltd. Global Foundries is acknowledged for silicon fabrication.
Academy of Finland Grant Number: 318927
Detailed Information: 318927 (Academy of Finland Funding decision)
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