University of Oulu

M. H. Montaseri, R. Vuohtoniemi, J. Aikio, T. Rahkonen and A. Pärssinen, "Design of Multi-Stacked CMOS mm-Wave Power Amplifiers for Phased Array Applications Using Triple-Well Process," 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC), Tallinn, 2018, pp. 1-5. doi: 10.1109/NORCHIP.2018.8573452

Design of multi-stacked CMOS mm-wave power amplifiers for phased array applications using triple-well process

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Author: Montaseri, Mohammad Hassan1; Vuohtoniemi, Risto1; Aikio, Janne1;
Organizations: 1RF/mm-wave Circuits and Systems, Center for Wireless Communications, Dept. ITEE University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.6 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe201902134755
Language: English
Published: Institute of Electrical and Electronics Engineers, 2018
Publish Date: 2019-02-13
Description:

Abstract

This paper concerns with the design of multi-stacked CMOS millimeter-wave power amplifiers suitable for phased array front-end applications using triple-well process. The parasitics posed by the triple-well technique are studied and compensated using negative capacitance technique for proper operation. The design technique is evaluated using TSMC 28nm CMOS process at 28GHz operating frequency as a candidate operating band for 5G systems. The results illustrate a power gain of 25dB, 22dBm saturated power, and a maximum 38% PAE along with superior phase alignment between stacks.

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ISBN: 978-1-5386-7656-1
ISBN Print: 978-1-5386-7657-8
Article number: 8573452
DOI: 10.1109/NORCHIP.2018.8573452
OADOI: https://oadoi.org/10.1109/NORCHIP.2018.8573452
Host publication: 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC)
Conference: IEEE Nordic Circuits and Systems Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
5G
Funding: This research has been sponsored by InfoTech Oulu Doctoral Program, Finnish Funding Agency for Technology and Innovation (Tekes), Nokia, Esju and CoreHW. This work was also supported in part by the Academy of Finland 6Genesis Flagship (grant no. 318927).
Academy of Finland Grant Number: 318927
Detailed Information: 318927 (Academy of Finland Funding decision)
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