University of Oulu

Varghese, J. & Siponkoski, T. & Sobocinski, M. & Vahera, T. & Jantunen, H. (2018). In ACS Appl. Mater. Interfaces, 2018, 10 (13), pp 11048–11055. DOI: 10.1021/acsami.8b00978

Multilayer functional tapes cofired at 450 °C : beyond HTCC and LTCC technologies

Saved in:
Author: Varghese, Jobin1; Siponkoski, Tuomo1; Sobocinski, Maciej1;
Organizations: 1Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, FI-90014 Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1.1 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe201902215865
Language: English
Published: American Chemical Society, 2018
Publish Date: 2019-03-07
Description:

Abstract

This paper reports the first ultralow sintering temperature (450 °C) cofired multifunctional ceramic substrate based on a commercial lead zirconium titanate (PZ29)–glass composite, which is fabricated by tape casting, isostatic lamination, and sintering. This substrate was prepared from a novel tape casting slurry composition suitable for cofiring at low temperatures with commercial Ag electrodes at 450 °C. The green cast tape and sintered substrate showed a surface roughness of 146 and 355 nm, respectively, suitable for device-level fabrication by postprocessing. Additionally, the ferroelectric and piezoelectric studies disclosed low remnant polarization due to the dielectric glass matrix with average values of piezoelectric coefficient (+d33) and voltage coefficient (+g33) of 17 pC/N and 30 mV/N, respectively. The dielectric permittivity and loss value of the sintered substrates were 57.8 and 0.05 respectively, at 2.4 GHz. The variation of relative permittivity on temperature dependence in the range of −40 to 80 °C was about 23%, while the average linear coefficient of thermal expansion was 6.9 ppm/°C in the measured temperature range of 100–300 °C. Moreover, the shelf life of the tape over 28 months was studied through measurement of the stability of the dielectric properties over time. The obtained results open up a new strategy for the fabrication of next-generation low-cost functional ceramic devices prepared at an ultralow temperature in comparison to the high-temperature cofired ceramic and low-temperature cofired ceramic technologies.

see all

Series: ACS applied materials & interfaces
ISSN: 1944-8244
ISSN-E: 1944-8252
ISSN-L: 1944-8244
Volume: 10
Issue: 13
Pages: 11048 - 11055
DOI: 10.1021/acsami.8b00978
OADOI: https://oadoi.org/10.1021/acsami.8b00978
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
Subjects:
CTE
Funding: Authors are grateful to European Research Council Project no: 24001893 for the financial support. J.V. is thankful to Ulla Tuominen Foundation project grant 2018.
Copyright information: This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS applied materials & interfaces, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acsami.8b00978.