Sparse Tikhonov-Regularized Hashing for Multi-Modal Learning |
|
Author: | Tian, Lei1,2; Hong, Xiaopeng1; Fan, Chunxiao2; |
Organizations: |
1The Center for Machine Vision and Signal Analysis, University of Oulu, Finland, 90014 2Beijing University of Posts and Telecommunications, Beijing, P.R.China, 100876 |
Format: | article |
Version: | accepted version |
Access: | open |
Online Access: | PDF Full Text (PDF, 0.3 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe201902286521 |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers,
2018
|
Publish Date: | 2019-02-28 |
Description: |
AbstractThis paper mainly focuses on the role of regularization in Multi-Modal Learning (MML). Existing MML studies devote most of the efforts in maximizing the consensus of models from cues of different modalities. However, regularization methods are still far from fully explored. To fill in this gap, we propose a compact and efficient coding solution, termed by sparse Tikhonov-Regularized Hashing (STRH). The STRH enforces both the ℓ₀-norm induced sparsity constraints and the Tikhonov regularization on the binary solution vectors which maximize cross-modal correlation. In addition, we raise the concerns on the challenging testing scenario of ‘Multi-modal Learning and Single-modal Prediction’ (MLSP). Finally, we demonstrate that the STRH is an efficient hashing solutions by showing its superiority under the MLSP scenario. see all
|
Series: |
IEEE International Conference on Image Processing |
ISSN: | 1522-4880 |
ISSN-E: | 2381-8549 |
ISSN-L: | 1522-4880 |
ISBN: | 978-1-4799-7061-2 |
ISBN Print: | 978-1-4799-7062-9 |
Pages: | 3793 - 3797 |
DOI: | 10.1109/ICIP.2018.8451580 |
OADOI: | https://oadoi.org/10.1109/ICIP.2018.8451580 |
Host publication: |
2018 25th IEEE International Conference on Image Processing (ICIP) |
Conference: |
IEEE International Conference on Image Processing |
Type of Publication: |
A4 Article in conference proceedings |
Field of Science: |
213 Electronic, automation and communications engineering, electronics |
Subjects: | |
Funding: |
This work was supported by the National Natural Science Foundation of China (Grants No. 61402046, 61572205, 61772419), Beijing Natural Science Foundation (Grants No. 4172024), the Academy of Finland, Infotech Oulu, Tekes Fidipro program (Grant No. 1849/31/2015) and Tekes project (Grant No. 3116/31/2017). |
Copyright information: |
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |