Li₂ZnTi₃O₈ based High κ LTCC tapes for improved thermal management in hybrid circuit applications |
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Author: | Arun, S.1; Sebastian, M.T.2; Surendran, K.P.1 |
Organizations: |
1Materials Science and Technology Division, National Institute for Interdisciplinary Science and Technology, CSIR, Trivandrum 695019, India 2Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, 90014 Finland |
Format: | article |
Version: | accepted version |
Access: | closed |
Persistent link: | http://urn.fi/urn:nbn:fi-fe2019052016101 |
Language: | English |
Published: |
Elsevier,
2017
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Publish Date: | 2019-05-31 |
Description: |
AbstractA low temperature co-fired ceramic based on Li₂ZnTi₃O₈ (LZT), that possess auspicious thermal and dielectric properties is reported. In order to achieve the low sintering temperature suitable for LTCC applications (875 °C), 1 wt% of 20:Li₂O-20: MgO-20: ZnO-20:B₂O₃-20: SiO₂ (LMZBS) glass was added to LZT ceramics. The post-milled powder had an average particle size of 450 nm with an effective surface area of 0.812 m²g⁻¹. A well dispersed tape casting slurry was prepared using xylene/ethanol mixture as solvent and fish oil as dispersant. The crystal structure and microstructure of the tapes were analyzed through XRD and scanning electron microscopy (SEM). The microwave dielectric properties of the green as well as sintered tapes were measured at different frequencies (5, 10 and 15 GHz). The Li₂ZnTi₃O₈+1 wt% LMZBS has shown excellent thermal conductivity of 5.8 W/mK, thermal expansivity (11.97 ppm/°C) closer to silver electrode, low temperature coefficient of dielectric constant (−29 ppm/°C) and ultralow dielectric losses (tanδ~10⁻⁴). see all
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Series: |
Ceramics international |
ISSN: | 0272-8842 |
ISSN-E: | 1873-3956 |
ISSN-L: | 0272-8842 |
Volume: | 43 |
Issue: | 7 |
Pages: | 5509 - 5516 |
DOI: | 10.1016/j.ceramint.2017.01.073 |
OADOI: | https://oadoi.org/10.1016/j.ceramint.2017.01.073 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
216 Materials engineering |
Subjects: | |
Funding: |
Authors are grateful for thefinancial support from the DST fundedproject (File no: DST/TSG/NTS/2012/89). |
Copyright information: |
© 2017 Elsevier Ltd and Techna Group S.r.l. |