Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications
|Author:||Induja, Indira J.1; Sebastian, Mailadil T.2|
1Materials Science & Technology Division, National Institute for Interdisciplinary Science Technology, Thiruvananthapuram, India
2Microelectronics Research Unit, Faculty of Information Technology & Electrical Engineering, University of Oulu, Oulu, Finland
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2019052016177
John Wiley & Sons,
|Publish Date:|| 2019-05-20
Ultralow‐temperature sinterable alumina‐45SnF₂:25SnO:30P₂O₅ glass (Al₂O₃‐SSP glass) composite has been developed for microelectronic applications. The 45SnF₂:25SnO:30P₂O₅ glass prepared by melt quenching from 450°C has a low Tg of about 93°C. The SSP glass has εᵣ and tanδ of 20 and 0.007, respectively, at 1 MHz. In the microwave frequency range, it has εᵣ=16 and Qᵤ × f=990 GHz with τf=−290 ppm/°C at 6.2 GHz with coefficient of thermal expansion (CTE) value of 17.8 ppm/°C. A 30 wt.% Al₂O₃‐70 wt.% SSP composite was prepared by sintering at different temperatures from 150°C to 400°C. The crystalline phases and dielectric properties vary with sintering temperature. The alumina‐SSP composite sintered at 200°C has εᵣ=5.41 with a tanδ of 0.01 (1 MHz) and at microwave frequencies it has εᵣ=5.20 at 11 GHz with Qᵤ × f=5500 GHz with temperature coefficient of resonant frequency (τf)=−18 ppm/°C. The CTE and room‐temperature thermal conductivity of the composite sintered at 200°C are 8.7 ppm/°C and 0.47 W/m/K, respectively. The new composite has a low sintering temperature and is a possible candidate for ultralow‐temperature cofired ceramics applications.
Journal of the American ceramic society
|Pages:||2632 - 2640|
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
216 Materials engineering
© 2017 The American Ceramic Society. This is the peer reviewed version of the following article: Induja, IJ, Sebastian, MT. Microwave dielectric properties of SnO‐SnF₂‐P₂O₅ glass and its composite with alumina for ULTCC applications. J Am Ceram Soc. 2017; 100: 2632– 2640, which has been published in final form at https://doi.org/10.1111/jace.14804. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.