Preparation, characterization and properties of alumina-lithium aluminium borosilicate glass based LTCC tapes |
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Author: | Induja, I. J.1; Varma, M. R.1; Sebastian, M. T.2 |
Organizations: |
1Materials Science & Technology Division, National Institute for Interdisciplinary Science & Technology, Thiruvananthapuram 695019, India 2Microelectronics Research Unit, Faculty of Information Technology & Electrical Engineering, University of Oulu, P.O. Box 4500, 90014 Oulu, Finland |
Format: | article |
Version: | accepted version |
Access: | open |
Online Access: | PDF Full Text (PDF, 3.5 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe2019052016185 |
Language: | English |
Published: |
Springer Nature,
2017
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Publish Date: | 2019-05-20 |
Description: |
AbstractA new low temperature cofired ceramic (LTCC) tape based on 40 wt% Al₂O₃–60 wt% LABS glass (40Li₂CO₃:10Al₂O₃:30B₂O₃:20SiO₂) has been developed. The dielectric properties of the LABS glass are studied. The structural, dielectric, thermal as well as the chemical compatibility with Ag electrode of the bulk Al₂O₃–LABS sintered at 800 °C are investigated. The room temperature thermal conductivity and CTE of the bulk are 3.80 Wm⁻¹ K⁻¹ and 5.1 ppm/°C respectively. The Al₂O₃–LABS slurry which has a pseudoplastic nature is made into thin sheets using tape casting technique. The green tape has a surface roughness of 293 nm and tensile strength 0.2 MPa. The Al₂O₃–LABS based LTCC tapes are sintered at 775 °C has εᵣ of 4.70 with tanδ 0.005 and τε of +412 ppm/°C at 5 GHz. The results suggest that the Al₂O₃–LABS based LTCC tapes is a possible candidate for LTCC device applications. see all
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Series: |
Journal of materials science. Materials in electronics |
ISSN: | 0957-4522 |
ISSN-E: | 1573-482X |
ISSN-L: | 0957-4522 |
Volume: | 28 |
Issue: | 19 |
Pages: | 14655 - 14663 |
DOI: | 10.1007/s10854-017-7330-7 |
OADOI: | https://oadoi.org/10.1007/s10854-017-7330-7 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
213 Electronic, automation and communications engineering, electronics 216 Materials engineering |
Subjects: | |
Copyright information: |
© Springer Science+Business Media, LLC 2017. This is a post-peer-review, pre-copyedit version of an article published in Journal of Materials Science: Materials in Electronics Vol. 28 Issue 19. The final authenticated version is available online at: https://doi.org/10.1007/s10854-017-7330-7. |