University of Oulu

Induja, I.J., Varma, M.R. & Sebastian, M.T. J Mater Sci: Mater Electron (2017) 28: 14655.

Preparation, characterization and properties of alumina-lithium aluminium borosilicate glass based LTCC tapes

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Author: Induja, I. J.1; Varma, M. R.1; Sebastian, M. T.2
Organizations: 1Materials Science & Technology Division, National Institute for Interdisciplinary Science & Technology, Thiruvananthapuram 695019, India
2Microelectronics Research Unit, Faculty of Information Technology & Electrical Engineering, University of Oulu, P.O. Box 4500, 90014 Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 3.5 MB)
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Language: English
Published: Springer Nature, 2017
Publish Date: 2019-05-20


A new low temperature cofired ceramic (LTCC) tape based on 40 wt% Al₂O₃–60 wt% LABS glass (40Li₂CO₃:10Al₂O₃:30B₂O₃:20SiO₂) has been developed. The dielectric properties of the LABS glass are studied. The structural, dielectric, thermal as well as the chemical compatibility with Ag electrode of the bulk Al₂O₃–LABS sintered at 800 °C are investigated. The room temperature thermal conductivity and CTE of the bulk are 3.80 Wm⁻¹ K⁻¹ and 5.1 ppm/°C respectively. The Al₂O₃–LABS slurry which has a pseudoplastic nature is made into thin sheets using tape casting technique. The green tape has a surface roughness of 293 nm and tensile strength 0.2 MPa. The Al₂O₃–LABS based LTCC tapes are sintered at 775 °C has εᵣ of 4.70 with tanδ 0.005 and τε of +412 ppm/°C at 5 GHz. The results suggest that the Al₂O₃–LABS based LTCC tapes is a possible candidate for LTCC device applications.

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Series: Journal of materials science. Materials in electronics
ISSN: 0957-4522
ISSN-E: 1573-482X
ISSN-L: 0957-4522
Volume: 28
Issue: 19
Pages: 14655 - 14663
DOI: 10.1007/s10854-017-7330-7
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
216 Materials engineering
Copyright information: © Springer Science+Business Media, LLC 2017. This is a post-peer-review, pre-copyedit version of an article published in Journal of Materials Science: Materials in Electronics Vol. 28 Issue 19. The final authenticated version is available online at: