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Solid air-low temperature manufacturing of ultra-low permittivity composite materials for future telecommunication systems |
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| Author: | Nelo, Mikko1; Liimatainen, Henrikki2; Väätäjä, Maria1; |
| Organizations: |
1Microelectronics Research Unit, University of Oulu, Oulu, Finland 2Fiber and Particle Engineering, University of Oulu, Oulu, Finland |
| Format: | article |
| Version: | published version |
| Access: | open |
| Online Access: | PDF Full Text (PDF, 4.3 MB) |
| Persistent link: | http://urn.fi/urn:nbn:fi-fe2019091628440 |
| Language: | English |
| Published: |
Frontiers Media,
2019
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| Publish Date: | 2019-09-16 |
| Description: |
AbstractThe frequency spectrum to be used by future wireless telecommunication systems such as 5G and beyond requires novel materials which are environment-friendly, are low cost and, most importantly, have low dielectric loss and permittivity when approaching higher frequencies. In this work, the development of all-inorganic composites with a relative permittivity of ~1.2 and loss tangents in the range of 10−3 is presented. The composites were fabricated at the exceptionally low temperature of 120°C and were based on lithium molybdate (Li2MoO4) ceramic as a water-soluble binder reinforced by quartz fibers. The relative permittivity was further decreased by the addition of hollow micron-sized glass spheres having very low dielectric loss. A simple manufacturing method through filtration, stencil printing and drying is presented. The microstructure of the composites was investigated with FESEM microscopy and the dielectric properties by SPDR. Printing tests were carried out in order to evaluate the possibility of using the proposed composites in, for example, printed antenna applications. see all
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| Series: |
Frontiers in materials |
| ISSN: | 2296-8016 |
| ISSN-E: | 2296-8016 |
| ISSN-L: | 2296-8016 |
| Volume: | 6 |
| Article number: | 94 |
| DOI: | 10.3389/fmats.2019.00094 |
| OADOI: | https://oadoi.org/10.3389/fmats.2019.00094 |
| Type of Publication: |
A1 Journal article – refereed |
| Field of Science: |
213 Electronic, automation and communications engineering, electronics |
| Subjects: | |
| Funding: |
The work leading to these results has received funding from the European Research Council (ERC) under the ERC POC grant agreement No. 812837. This work was supported in part by the Academy of Finland 6 Genesis Flagship (grant no. 318927) and by the Academy of Finland Printed Intelligence Infrastructure, PII (grant no. 320020). |
| EU Grant Number: |
(812837) FUNCOMP - Fabricating Functional Components in Room Temperature |
| Academy of Finland Grant Number: |
318927 320020 |
| Detailed Information: |
318927 (Academy of Finland Funding decision) 320020 (Academy of Finland Funding decision) |
| Copyright information: |
Copyright © 2019 Nelo, Liimatainen, Väätäjä, Ukkola, Juuti and Jantunen. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms. |
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https://creativecommons.org/licenses/by/4.0/ |