University of Oulu

Joseph, N., Varghese, J., Teirikangas, M., Vahera, T., & Jantunen, H. (2019). Ultra-Low-Temperature Cofired Ceramic Substrates with Low Residual Carbon for Next-Generation Microwave Applications. ACS Applied Materials & Interfaces, 11(26), 23798–23807.

Ultra-low-temperature cofired ceramic substrates with low residual carbon for next-generation microwave applications

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Author: Joseph, Nina1; Varghese, Jobin1; Teirikangas, Merja1;
Organizations: 1Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, FI-90014 Oulu, Finland
Format: article
Version: published version
Access: open
Online Access: PDF Full Text (PDF, 6 MB)
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Language: English
Published: American Chemical Society, 2019
Publish Date: 2019-09-18


High-temperature cofired ceramics and low-temperature cofired ceramics are important technologies in the fabrication of multilayer ceramic substrates for discrete devices, electronics packages, and telecommunications. However, there is a place and need for materials with lower fabrication temperatures to decrease the associated energy consumption. The present paper studies the feasibility of two ultra-low sintering temperature cofired ceramic materials, copper molybdate and copper molybdate–Ag2O, sinterable at 650 and 500 °C, respectively, for multilayer substrates using tape casting. The slurry composition developed uses environmentally friendly organics and a nontoxic binder and solvent. Additionally, the green cast tapes exhibit very low residual carbon (less than 5%) after sintering on analysis by X-ray photoelectron spectroscopy. The multilayer substrates show a permittivity value of about 8 with a low dielectric loss in the range of 10–5 to 10–4 in the frequency range of 2–10 GHz along with a low coefficient of thermal expansion in the range of 4–5 ppm/°C and good compatibility with an Al electrode. Thus, these proposed substrates have much promise, with good thermal, mechanical, and dielectric properties comparable to commercial substrates while also providing an energy and environment-friendly solution.

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Series: ACS applied materials & interfaces
ISSN: 1944-8244
ISSN-E: 1944-8252
ISSN-L: 1944-8244
Volume: 11
Issue: 26
Pages: 23798 - 23807
DOI: 10.1021/acsami.9b07272
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
213 Electronic, automation and communications engineering, electronics
Funding: The authors are thankful to European Research Council (ERC) project no. 24001893 and ERC POC no. 812837 for the financial support. The second author is grateful to the Ulla Tuominen Foundation project grant in 2018. This work was also partially supported by the Academy of Finland 6Genesis Flagship (grant 318927).
EU Grant Number: (812837) FUNCOMP - Fabricating Functional Components in Room Temperature
Academy of Finland Grant Number: 318927
Detailed Information: 318927 (Academy of Finland Funding decision)
Copyright information: This is an open access article published under a Creative Commons Attribution (CC-BY) License, which permits unrestricted use, distribution and reproduction in any medium, provided the author and source are cited.