University of Oulu

J. Mizsei, J. Lappalainen, Microelectronics, Nanoelectronics: step behind the red brick wall using the thermal domain, Materials Today: Proceedings, Volume 7, Part 3, 2019, Pages 888-893, ISSN 2214-7853,

Microelectronics, nanoelectronics : step behind the red brick wall using the thermal domain

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Author: Mizsei, J.1; Lappalainen, J.2
Organizations: 1Budapest University of Techn. and Economics, Department of Electron Devices, Budapest, 1521, Hungary
2University of Oulu, Faculty of Information Technology and Electrical Engineering, Oulu, 90570, Finland
Format: article
Version: published version
Access: open
Online Access: PDF Full Text (PDF, 0.6 MB)
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Language: English
Published: Elsevier, 2019
Publish Date: 2019-10-15


The More-than-Moore Grand Challenge is a hot topic of present day solid state electronics: one way to step behind the “red brick wall” is the 3D heterogeneous integration of different systems with the conventional (standard) CMOS-technology. The aim of this study is to summarize the different bit representation methods, especially possibilities of our new, patented phonsistor (phonon transistor) based thermal-electronic logic system or thermal-electronic logic circuit (TELC). TELC is the first logic gate approach using two different physical quantities, i.e. electrical and thermal for bit representation within one system.

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Series: Materials today. Proceedings
ISSN: 2214-7853
ISSN-E: 2214-7853
ISSN-L: 2214-7853
Volume: 7
Pages: 888 - 893
DOI: 10.1016/j.matpr.2018.12.089
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: Research is supported by the project NN 110867 of the Hungarian Scientific Research Fund (OTKA) organized by the “National Research, Development and Innovation Office” (NRDI). Thanks to Gordon Moore for this encouraging and stimulating sentence: „Nothing beats scaled silicon but nanotechnology can complement!”
Copyright information: © 2018 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (