Microelectronics, nanoelectronics : step behind the red brick wall using the thermal domain |
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Author: | Mizsei, J.1; Lappalainen, J.2 |
Organizations: |
1Budapest University of Techn. and Economics, Department of Electron Devices, Budapest, 1521, Hungary 2University of Oulu, Faculty of Information Technology and Electrical Engineering, Oulu, 90570, Finland |
Format: | article |
Version: | published version |
Access: | open |
Online Access: | PDF Full Text (PDF, 0.6 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe2019101532713 |
Language: | English |
Published: |
Elsevier,
2019
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Publish Date: | 2019-10-15 |
Description: |
AbstractThe More-than-Moore Grand Challenge is a hot topic of present day solid state electronics: one way to step behind the “red brick wall” is the 3D heterogeneous integration of different systems with the conventional (standard) CMOS-technology. The aim of this study is to summarize the different bit representation methods, especially possibilities of our new, patented phonsistor (phonon transistor) based thermal-electronic logic system or thermal-electronic logic circuit (TELC). TELC is the first logic gate approach using two different physical quantities, i.e. electrical and thermal for bit representation within one system. see all
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Series: |
Materials today. Proceedings |
ISSN: | 2214-7853 |
ISSN-E: | 2214-7853 |
ISSN-L: | 2214-7853 |
Volume: | 7 |
Pages: | 888 - 893 |
DOI: | 10.1016/j.matpr.2018.12.089 |
OADOI: | https://oadoi.org/10.1016/j.matpr.2018.12.089 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
213 Electronic, automation and communications engineering, electronics |
Subjects: | |
Funding: |
Research is supported by the project NN 110867 of the Hungarian Scientific Research Fund (OTKA) organized by the “National Research, Development and Innovation Office” (NRDI). Thanks to Gordon Moore for this encouraging and stimulating sentence: „Nothing beats scaled silicon but nanotechnology can complement!” |
Copyright information: |
© 2018 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). |
https://creativecommons.org/licenses/by-nc-nd/4.0/ |