University of Oulu

E. Hannila, B. Augustine, T. Kurkela, J. Lauri and T. Fabritius, "Yield and Electrical Functionality of the Glass-Laminated Conductive Wires and Connectors," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2499-2505, Dec. 2019. doi: 10.1109/TCPMT.2019.2923858

Yield and electrical functionality of the glass laminated conductive wires and connectors

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Author: Hannila, Esa1; Augustine, Bobins1; Kurkela, Timo1;
Organizations: 1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Erkki Koiso-Kanttilankatu 3, 90570 Oulu
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.7 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2019121348052
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2019-12-13
Description:

Abstract

Large-area electronics is becoming an embedded part of structural elements such as automotive and architectural glasses. In this paper, the effect of glass-lamination-based fabrication process on the electrical performance and production throughput yield (TPY) of printed conductive wires and surface-mounted (SMD) connectors on polyethylene terephthalate (PET) carrier film was investigated by measuring their electrical conductivity after lamination. Based on the experiments, lamination decreases the production yield of conductive wires and connectors due to broken wires or dislocated connectors, especially if they are located close to the corners of the laminate. On the other hand, lamination was observed to improve the electrical conductivity of wires. In addition, some potential failure mechanisms are discussed.

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Series: IEEE transactions on components, packaging, and manufacturing technology
ISSN: 2156-3950
ISSN-E: 2156-3985
ISSN-L: 2156-3950
Volume: 9
Issue: 12
Pages: 2499 - 2505
DOI: 10.1109/TCPMT.2019.2923858
OADOI: https://oadoi.org/10.1109/TCPMT.2019.2923858
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
Funding: This work is financially supported by Business Finland funded project (Dnro 3944/31/2014), Academy of Finland’s Printed intelligence infrastructure (grant no. 320017) and European Regional Development Fund’s Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications (grant no. A74080).
Academy of Finland Grant Number: 320017
Detailed Information: 320017 (Academy of Finland Funding decision)
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