R. Akbar et al., "A Wideband IF Receiver Module for Flexibly Scalable mmWave Beamforming Combining and Interference Cancellation," ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference (ESSCIRC), Cracow, Poland, 2019, pp. 213-216. doi: 10.1109/ESSCIRC.2019.8902869
A wideband IF receiver module for flexibly scalable mmWave beamforming combining and interference cancellation
|Author:||Akbar, Rehman1; Klumperink, Eric A. M.2; Tervo, Nuutti1;|
1Center for Wireless Comunication, University of Oulu, Oulu, Finland
2University of Twente, Enschede, Netherlands
3Aalto University , Espoo, Finland
4Circuits and systems Group, University of Oulu, Oulu, Finland
|Online Access:||PDF Full Text (PDF, 1.3 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2019121348110
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2019-12-13
Large-scale phased arrays need to combine weighted signals from multiple sub-arrays either in analog or in digital domain. Sub-arrays are preferably implemented modularly with integrated circuits placed next to the associated antennas. In order to enable flexible and scalable combining networks of several mmWave sub-arrays, this paper presents a wideband receiver module that provides the cartesian combining of beamforming weights for one sub-array at IF. Furthermore, it allows interference cancellation between sub-arrays or combining multiple sub-arrays. It also provides filtering before ADCs to support current and foreseeable 5G channel bandwidths up to 800MHz. The receiver is operating at 2–4GHz IF frequency range and has more than 400MHz baseband bandwidth, a noise-figure of 5.5dB, -6dBm 1dB compression point and +3dBm in-band IIP3. In addition, over-the-air measurements are performed, showing 26dB of interference cancellation between the sub-arrays. The prototype is implemented using 45nm CMOS PDSOI.
Proceedings of ESSCIRC
|Pages:||213 - 216|
49th European Solid-State Device Research Conference and 45th European Solid-State Circuits Conference. September 23-26, 2019 Kraków, Poland
European Solid-State Device Research Conference and European Solid-State Circuits Conference
|Type of Publication:||
A4 Article in conference proceedings
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
This research has been financially supported by Academy of Finland Ex5GRx (grant 2430226211) and also in part 6Genesis Flagship (grant 318927). The authors would like to thank Global Foundries for support in process technology.
|Academy of Finland Grant Number:||
318927 (Academy of Finland Funding decision)
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