University of Oulu

J. Lauri, E. Hannila and T. Fabritius, "Non-Destructive Characterization of Glass Laminated Electronics," 2019 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Auckland, New Zealand, 2019, pp. 1-5. doi: 10.1109/I2MTC.2019.8827057

Non-destructive characterization of glass laminated electronics

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Author: Lauri, Janne1; Hannila, Esa1; Fabritius, Tapio1
Organizations: 1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.9 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2019121648351
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2019-12-16
Description:

Abstract

By integrating electronics inside the laminated glass, the windows and structural glass elements can be transformed to be functional and interactive. Once the electronics is embedded into the glass in lamination process, the electronics is exposed to different type of stresses, having an influence on performance and reliability. In order to understand the consequences of lamination and to explain the reason for failures, non-destructive optical coherence tomography (OCT) based method was used in this study. In addition, thermo-mechanical simulations were done to find possible causes for observed failures in light emitting device (LED) chips and wirings. Combining the analyzed OCT data with simulations, was shown to be very effective tool to select right materials and optimize the lamination process for glass embedded electronics.

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Series: IEEE International Instrumentation and Measurement Technology Conference
ISSN: 2642-2069
ISSN-E: 2642-2077
ISSN-L: 2642-2069
ISBN: 978-1-5386-3460-8
ISBN Print: 978-1-5386-3461-5
Pages: 1 - 5
DOI: 10.1109/I2MTC.2019.8827057
OADOI: https://oadoi.org/10.1109/I2MTC.2019.8827057
Conference: IEEE International Instrumentation and Measurement Technology
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
216 Materials engineering
Subjects:
Funding: We thank Technical Research Center of Finland Ltd (VTT) for providing the glass laminate and non-laminated LED chip samples and technical advice for this research.
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