University of Oulu

M. Hietanen, J. Aikio, A. Sethi, R. Akbar, T. Rahkonen and A. Pärssinen, "Optimizing Inductorless Static CML Frequency Dividers up to 23GHz Output Using 45nm CMOS PD-SOI," 2019 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC), Helsinki, Finland, 2019, pp. 1-4. doi: 10.1109/NORCHIP.2019.8906899

Optimizing inductorless static CML frequency dividers up to 23GHz output using 45nm CMOS PD-SOI

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Author: Hietanen, Mikko1; Aikio, Janne2; Sethi, Alok1;
Organizations: 1Centre for Wireless Communications, University of Oulu, Oulu, Finland
2Circuits and Systems, University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1 MB)
Persistent link:
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2019-12-17


Two mmWave frequency dividers were designed, manufactured and measured using static current mode logic divider topology on 45nm CMOS PD-SOI technology. Dividers differ by flip-flop load, first divider uses resistive loads and second divider active PMOS loads. Achieved output referred frequency ranges cover 13—22GHz on the first divider and 8—23GHz on the second divider. Both dividers occupy small areas of $0.002\mathrm{mm}^{2}$ and $0.0017\mathrm{mm}^{2}$ respectively and dissipate only 10.3mW and 11mW from 1V supply. The broad tuning range, moderate speed, small area and I/Q output phases make this divider architecture an attractive option for sliding-IF transceiver topologies operating up to 69GHz carrier frequency and enable operation of PLL’s up to 46GHz.

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ISBN: 978-1-7281-2769-9
ISBN Print: 978-1-7281-2770-5
Pages: 1 - 4
DOI: 10.1109/NORCHIP.2019.8906899
Host publication: 2019 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC) 29-30 Oct 2019 Helsinki, Finland
Conference: IEEE Nordic Circuits and Systems Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: This research has been financially supported by Academy of Finland 6Genesis Flagship (grant 318927) and Nokia Corporation Ltd. Global Foudries is acknowledged for silicon fabrication and technical support.
Academy of Finland Grant Number: 318927
Detailed Information: 318927 (Academy of Finland Funding decision)
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