University of Oulu

A. Nakamura, T. Kobayashi, C. Sugimoto and R. Kohno, "Localization of Implanted Devices Combining TDOA, Particle Filter and Map Mapping with Intestine Modeling," 2019 13th International Symposium on Medical Information and Communication Technology (ISMICT), Oslo, Norway, 2019, pp. 1-4. doi: 10.1109/ISMICT.2019.8743980

Localization of implanted devices combining TDOA, particle filter and map mapping with intestine modeling

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Author: Nakamura, Ayaka1; Kobayashi, Takumi1; Sugimoto, Chika1;
Organizations: 1Graduate School of Engineering Science, Yokohama National University, Japan
2Centre for Wireless Communications, Faculty of ITEE, University of Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.8 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2019121848811
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2019-12-18
Description:

Abstract

In this paper, we propose a scheme to estimate the position of medical implanted device such as a capsule endoscopy in an intestine using combination among TDOA ranging/positioning, particle filter, and map information based on 2D/3D images taken by MRI or CT systems to compensate estimation error of implanted device position. The proposal scheme can perform reliable ranging and positioning by the compensation using the image which obtained by slicing small intestine, which we create with computer graphics and estimating the distance from the image by CNN.

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Series: International Symposium on Medical Information and Communication Technology
ISSN: 2326-828X
ISSN-E: 2326-8301
ISSN-L: 2326-828X
ISBN: 978-1-7281-2342-4
ISBN Print: 978-1-7281-2343-1
Article number: 8743980
DOI: 10.1109/ISMICT.2019.8743980
OADOI: https://oadoi.org/10.1109/ISMICT.2019.8743980
Host publication: 2019 13th International Symposium on Medical Information and Communication Technology (ISMICT)
Conference: International Symposium on Medical Information and Communication Technology
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
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