K. Remes and T. Fabritius, "Non-Contact Characterization of Flexible Hybrid Electronics by Synchronized Thermography," in IEEE Transactions on Instrumentation and Measurement, vol. 69, no. 5, pp. 2390-2397, May 2020, doi: 10.1109/TIM.2019.2962576
Non-contact characterization of flexible hybrid electronics by synchronized thermography
|Author:||Remes, Kari1; Fabritius, Tapio1|
1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
|Online Access:||PDF Full Text (PDF, 0.7 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe202002195809
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2020-02-19
Eddy current heating with synchronized thermography (ST) is utilized for the contactless characterization of flexible hybrid electronics. A proposed approach is used for analyzing the uniformity of large area electronics being the basis for the quality assurance of hybrid electronics manufacturing. Flexible polymer substrate with printed conductors, bonded conventionally manufactured light-emitting diode (LED) chips and current regulators were used as test samples. Obtained results show that ST with eddy current heating is an effective and roll-to-roll compatible measurement tool for in-situ quality monitoring of hybrid electronics manufacturing.
IEEE transactions on instrumentation and measurement
|Pages:||2390 - 2397|
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
We thank Technical Research Center of Finland Ltd (VTT) for providing the LED foil samples and technical advice for this research. Authors would also like to thank the financial support from the Academy of Finland’s FIRI funding (grant no. 320017) and EU Regional Development Fund (A74080).
|Academy of Finland Grant Number:||
320017 (Academy of Finland Funding decision)
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