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K. Remes and T. Fabritius, "Non-Contact Characterization of Flexible Hybrid Electronics by Synchronized Thermography," in IEEE Transactions on Instrumentation and Measurement, vol. 69, no. 5, pp. 2390-2397, May 2020, doi: 10.1109/TIM.2019.2962576

Non-contact characterization of flexible hybrid electronics by synchronized thermography

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Author: Remes, Kari1; Fabritius, Tapio1
Organizations: 1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.7 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe202002195809
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2020-02-19
Description:

Abstract

Eddy current heating with synchronized thermography (ST) is utilized for the contactless characterization of flexible hybrid electronics. A proposed approach is used for analyzing the uniformity of large area electronics being the basis for the quality assurance of hybrid electronics manufacturing. Flexible polymer substrate with printed conductors, bonded conventionally manufactured light-emitting diode (LED) chips and current regulators were used as test samples. Obtained results show that ST with eddy current heating is an effective and roll-to-roll compatible measurement tool for in-situ quality monitoring of hybrid electronics manufacturing.

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Series: IEEE transactions on instrumentation and measurement
ISSN: 0018-9456
ISSN-E: 1557-9662
ISSN-L: 0018-9456
Volume: 69
Issue: 5
Pages: 2390 - 2397
DOI: 10.1109/TIM.2019.2962576
OADOI: https://oadoi.org/10.1109/TIM.2019.2962576
Type of Publication: A1 Journal article – refereed
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
eddy-current
infrared imaging
optical measurement techniques
printed electronics
quality control
uniformity
Article
Funding: We thank Technical Research Center of Finland Ltd (VTT) for providing the LED foil samples and technical advice for this research. Authors would also like to thank the financial support from the Academy of Finland’s FIRI funding (grant no. 320017) and EU Regional Development Fund (A74080).
Academy of Finland Grant Number: 320017
Detailed Information: 320017 (Academy of Finland Funding decision)
Copyright information: © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.