Flexible electronics non-destructive uniformity characterization by synchronized thermography |
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Author: | Remes, Kari1; Latomäki, Antti1; Fabritius, Tapio1 |
Organizations: |
1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland |
Format: | article |
Version: | accepted version |
Access: | open |
Online Access: | PDF Full Text (PDF, 0.7 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe202003249034 |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers,
2019
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Publish Date: | 2020-03-24 |
Description: |
AbstractSynchronized thermography (ST) is utilized in the characterization of a flexible hybrid electronics. ST is used for both in the analysis of the structural uniformity and electrical functionality. Flexible lighting foils combining conventionally manufactured light-emitting diode (LED) chips and current regulators with a printed wiring on polyethylene terephthalate (PET) substrate were used as test samples. The measurement results proves that ST measurement method is a feasible method for the uniformity and electrical functionality characterization of large-area printed thin films with conventional electronics. ST is an interesting option to be used as a measurement tool for online quality monitoring of hybrid electronics manufacturing. see all
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Series: |
IEEE International Instrumentation and Measurement Technology Conference |
ISSN: | 2642-2069 |
ISSN-E: | 2642-2077 |
ISSN-L: | 2642-2069 |
ISBN: | 978-1-5386-3460-8 |
ISBN Print: | 978-1-5386-3461-5 |
Pages: | 1 - 5 |
Article number: | 8827135 |
DOI: | 10.1109/I2MTC.2019.8827135 |
OADOI: | https://oadoi.org/10.1109/I2MTC.2019.8827135 |
Host publication: |
2019 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2019, 20-23 May, Aucland, New Zealand |
Conference: |
IEEE International Instrumentation and Measurement Technology Conference |
Type of Publication: |
A4 Article in conference proceedings |
Field of Science: |
213 Electronic, automation and communications engineering, electronics |
Subjects: | |
Funding: |
The last author of this paper is financially supported by Academy of Finland’s 6Genesis Flagship (grant no. 318927) and Academy of Finland’s FIRI funding (grant no. 320017). |
Academy of Finland Grant Number: |
318927 320017 |
Detailed Information: |
318927 (Academy of Finland Funding decision) 320017 (Academy of Finland Funding decision) |
Copyright information: |
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