University of Oulu

K. Remes, A. Latomäki and T. Fabritius, "Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography," 2019 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Auckland, New Zealand, 2019, pp. 1-5. doi: 10.1109/I2MTC.2019.8827135

Flexible electronics non-destructive uniformity characterization by synchronized thermography

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Author: Remes, Kari1; Latomäki, Antti1; Fabritius, Tapio1
Organizations: 1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.7 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe202003249034
Language: English
Published: Institute of Electrical and Electronics Engineers, 2019
Publish Date: 2020-03-24
Description:

Abstract

Synchronized thermography (ST) is utilized in the characterization of a flexible hybrid electronics. ST is used for both in the analysis of the structural uniformity and electrical functionality. Flexible lighting foils combining conventionally manufactured light-emitting diode (LED) chips and current regulators with a printed wiring on polyethylene terephthalate (PET) substrate were used as test samples. The measurement results proves that ST measurement method is a feasible method for the uniformity and electrical functionality characterization of large-area printed thin films with conventional electronics. ST is an interesting option to be used as a measurement tool for online quality monitoring of hybrid electronics manufacturing.

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Series: IEEE International Instrumentation and Measurement Technology Conference
ISSN: 2642-2069
ISSN-L: 2642-2077 2642-2069
ISBN: 978-1-5386-3460-8
ISBN Print: 978-1-5386-3461-5
Pages: 1 - 5
Article number: 8827135
DOI: 10.1109/I2MTC.2019.8827135
OADOI: https://oadoi.org/10.1109/I2MTC.2019.8827135
Host publication: 2019 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2019, 20-23 May, Aucland, New Zealand
Conference: IEEE International Instrumentation and Measurement Technology Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
Funding: The last author of this paper is financially supported by Academy of Finland’s 6Genesis Flagship (grant no. 318927) and Academy of Finland’s FIRI funding (grant no. 320017).
Academy of Finland Grant Number: 318927
320017
Detailed Information: 318927 (Academy of Finland Funding decision)
320017 (Academy of Finland Funding decision)
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