University of Oulu

X. Chai, B. Hou, P. Zou, J. Zeng and j. Zhou, "INDICS: An Industrial Internet Platform," 2018 IEEE SmartWorld, Ubiquitous Intelligence & Computing, Advanced & Trusted Computing, Scalable Computing & Communications, Cloud & Big Data Computing, Internet of People and Smart City Innovation (SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI), Guangzhou, 2018, pp. 1824-1828, https://doi.org/10.1109/SmartWorld.2018.00307

INDICS : an industrial internet platform

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Author: Chai, Xudong1; Hou, Baocun2; Zou, Ping3;
Organizations: 1CASICloud Co. Ltd. Beijing, China
2Beijing Simulation Center Beijing, China
3Hangtian Zhizao Co. Ltd. Beijing, China
4University of Oulu Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.6 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2020042922903
Language: English
Published: Institute of Electrical and Electronics Engineers, 2018
Publish Date: 2020-04-29
Description:

Abstract

The industrial Internet integrates the Internet, big data, artificial intelligence, and the real economy. We introduce China’s first industrial Internet platform INDICS — one of the world’s first industrial Internet platforms. We present the INDICS system architecture, and examine three successful INDICS application cases.

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ISBN: 978-1-5386-9380-3
ISBN Print: 978-1-5386-9381-0
Pages: 1824 - 1828
Article number: 8560285
DOI: 10.1109/SmartWorld.2018.00307
OADOI: https://oadoi.org/10.1109/SmartWorld.2018.00307
Host publication: 4th IEEE SmartWorld, 15th IEEE International Conference on Ubiquitous Intelligence and Computing, Advanced and Trusted Computing, Scalable Computing and Communications, Cloud and Big Data Computing, Internet of People and Smart City Innovations, SmartWorld/UIC/ATC/ScalCom/CBDCom/IoP/SCI 2018
Host publication editor: Loulergue, F.
Wang, G.
Bhuiyan, M. Z. A.
Ma, X.
Li, P.
Roveri, M.
Han, Q.
Chen, L.
Conference: IEEE International Conference on Cloud and Big Data Computing
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
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