B. Li, X. Chai, B. Hou, L. Zhang, J. Zhou and Y. Liu, "New Generation Artificial Intelligence-Driven Intelligent Manufacturing (NGAIIM)," 2018 IEEE SmartWorld, Ubiquitous Intelligence & Computing, Advanced & Trusted Computing, Scalable Computing & Communications, Cloud & Big Data Computing, Internet of People and Smart City Innovation (SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI), Guangzhou, 2018, pp. 1864-1869, https://doi.org/10.1109/SmartWorld.2018.00313
New generation artificial intelligence-driven intelligent manufacturing (NGAIIM)
|Author:||Li, Bohu1; Chai, Xudong2; Hou, Baocun3;|
1Beijing University of Aeronautics and Astronautics Beijing, China
2CASICloud Co. Ltd. Beijing, China
3Beijing Simulation Center, Beijing, China
4University of Oulu, Finland Oulu, Finland
5Hangtian Zhizao Co. Ltd. Beijing, China
|Online Access:||PDF Full Text (PDF, 0.8 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2020042922935
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2020-04-29
In order to embrace new generation artificial intelligence to upgrade manufacturing industry, we propose the concept of new generation artificial intelligence-driven intelligent manufacturing (NGAIIM), which is a new manufacturing paradigm integrating human/machine/environment/information into product lifecycle activities. First, we introduce new generation artificial intelligence. Second, we present NGAIIM connotation, NGAIIM architecture and its technology system. Then, we examine a NGAIIM use case — CASICloud. Finally, we provide suggestions for directing the NGAIIM development.
|Pages:||1864 - 1869|
4th IEEE SmartWorld, 15th IEEE International Conference on Ubiquitous Intelligence and Computing, Advanced and Trusted Computing, Scalable Computing and Communications, Cloud and Big Data Computing, Internet of People and Smart City Innovations, SmartWorld/UIC/ATC/ScalCom/CBDCom/IoP/SCI 2018
|Host publication editor:||
Bhuiyan, M. Z. A.
IEEE International Conference on Cloud and Big Data Computing
|Type of Publication:||
A4 Article in conference proceedings
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
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