Intelligent edge : leveraging deep imitation learning for mobile edge computation offloading |
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Author: | Yu, Shuai1; Chen, Xu1; Yang, Lei2; |
Organizations: |
1Sun Yat-sen University 2University of Nevada 3University of Oulu
4Arizona State University
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Format: | article |
Version: | accepted version |
Access: | open |
Online Access: | PDF Full Text (PDF, 0.7 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe2020060841061 |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers,
2020
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Publish Date: | 2020-06-08 |
Description: |
AbstractIn this work, we propose a new deep imitation learning (DIL)-driven edge-cloud computation offloading framework for MEC networks. A key objective for the framework is to minimize the offloading cost in time-varying network environments through optimal behavioral cloning. Specifically, we first introduce our computation offloading model for MEC in detail. Then we make fine-grained offloading decisions for a mobile device, and the problem is formulated as a multi-label classification problem, with local execution cost and remote network resource usage consideration. To minimize the offloading cost, we train our decision making engine by leveraging the deep imitation learning method, and further evaluate its performance through an extensive numerical study. Simulation results show that our proposal outperforms other benchmark policies in offloading accuracy and offloading cost reduction. At last, we discuss the directions and advantages of applying deep learning methods to multiple MEC research areas, including edge data analytics, dynamic resource allocation, security, and privacy, respectively. see all
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Series: |
IEEE wireless communications |
ISSN: | 1536-1284 |
ISSN-E: | 1558-0687 |
ISSN-L: | 1536-1284 |
Volume: | 27 |
Issue: | 1 |
Pages: | 92 - 99 |
DOI: | 10.1109/MWC.001.1900232 |
OADOI: | https://oadoi.org/10.1109/MWC.001.1900232 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
213 Electronic, automation and communications engineering, electronics |
Subjects: | |
Funding: |
This work was supported in part by the National Key Research and Development Program of China (No. 2017YFB1001703); the National Science Foundation of China (No. U1711265, No. 61972432); the Fundamental Research Funds for the Central Universities (No. 17lgjc40, 19LGZD37); the Program for Basic and Applied Basic Research Fund of Guangdong (No. 2019A1515010030); the Program for Guangdong Introducing Innovative and Enterpreneurial Teams (No. 2017ZT07X355); the Pearl River Talent Recruitment Program (No. 2017GC010465); the U.S. National Science Foundation (IIS-1838024); and the Guangdong Special Support Program (2017TX04X148). |
Copyright information: |
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