Direct integration of dielectric all-ceramic thick films on a polymer substrate using room temperature fabrication |
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Author: | Väätäjä, Maria1; Kähäri, Hanna1; Ohenoja, Katja2; |
Organizations: |
1Microelectronics Research Unit, P.O. Box 4500, 90014, University of Oulu, Oulu, Finland 2Fibre and Particle Engineering Research Unit, P.O. Box 4300, 90014, University of Oulu, Oulu, Finland |
Format: | article |
Version: | published version |
Access: | open |
Online Access: | PDF Full Text (PDF, 1.4 MB) |
Persistent link: | http://urn.fi/urn:nbn:fi-fe2020061242895 |
Language: | English |
Published: |
Elsevier,
2020
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Publish Date: | 2020-06-12 |
Description: |
AbstractDirect integration of all-ceramic thick films and a polymer substrate has been realized for the first time without high temperature processing using the Room Temperature Fabrication method. Printable Li2MoO4-BaTiO3 composite pastes with 0, 10, and 20 vol.% of BaTiO3 were fabricated from the respective ceramic powders and water without organic additives or vehicles. The pastes were stencil printed on a polyimide substrate and dried at 120 °C without pressing or lamination. Using scanning electron microscopy, the films were observed to be in seamless contact with the substrate and to have a uniform microstructure. Relative permittivities of the ceramic films increased from 4.2 to 7.2 (at 2.5 GHz) and 4.5 to 7.5 (at 9.9 GHz) according to the vol.% content of the added BaTiO3, with corresponding dielectric losses from 10−3 to 10-2. The results show that the room temperature fabrication method enables 2D printing of all-ceramic thick films on temperature-sensitive substrates. see all
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Series: |
Journal of the European Ceramic Society |
ISSN: | 0955-2219 |
ISSN-E: | 1873-619X |
ISSN-L: | 0955-2219 |
Volume: | 40 |
Issue: | 12 |
Pages: | 3984 - 3988 |
DOI: | 10.1016/j.jeurceramsoc.2020.04.009 |
OADOI: | https://oadoi.org/10.1016/j.jeurceramsoc.2020.04.009 |
Type of Publication: |
A1 Journal article – refereed |
Field of Science: |
213 Electronic, automation and communications engineering, electronics 216 Materials engineering |
Subjects: | |
Funding: |
The work leading to these results has received funding from the European Research Council (ERC) under the European Union’s Seventh Framework Programme (FP7/2007-2013)/ERC grant agreement No. 291132. The work was also supported by ERC POC project no. 812837 and the Academy of Finland Research Infrastructure “Printed Intelligence Infrastructure” (PII-FIRI, grant No. 320017). Author M.V. gratefully acknowledges the financial support from Infotech Oulu Doctoral Programme, the Finnish Foundation for Technology Promotion, the Riitta and Jorma J. Takanen Foundation, the Walter Ahlström Foundation, and the Tauno Tönning Foundation. Author J. J. acknowledges funding from the Academy of Finland (grant agreement No. 318203). |
EU Grant Number: |
(812837) FUNCOMP - Fabricating Functional Components in Room Temperature (291132) ULTIMATE CERAMICS - Printed Electroceramics with Ultimate Compositions |
Academy of Finland Grant Number: |
320017 318203 |
Detailed Information: |
320017 (Academy of Finland Funding decision) 318203 (Academy of Finland Funding decision) |
Copyright information: |
© 2020 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/BY/4.0/). |
https://creativecommons.org/licenses/by/4.0/ |