E. Hannila, K. Remes, T. Kurkela, T. Happonen, K. Keränen and T. Fabritius, "The Effect of Torsional Bending on Reliability and Lifetime of Printed Silver Conductors," in IEEE Transactions on Electron Devices, vol. 67, no. 6, pp. 2522-2528, June 2020, doi: 10.1109/TED.2020.2990125
The effect of torsional bending on reliability and lifetime of printed silver conductors
|Author:||Hannila, Esa1; Remes, Kari1; Kurkela, Timo2;|
1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
2VTT Technical Research Centre of Finland Ltd., Oulu, Finland
|Online Access:||PDF Full Text (PDF, 0.7 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2020062645936
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2020-06-26
Capability of high-speed and low-cost manufacturing makes the printing techniques a very promising approach for large-area flexible electronics mass manufacturing. Due to fast and intensive technology development, the lack of knowledge about the reliability and lifetime of printed electronics is obvious, requiring further investigation. Especially, the effect of torsional bending on lifetime is a mostly unexplored field of reliability testing. In this article, a torsional bending test of parallel printed silver conductors (0.3-, 0.5-mm pitch) on polymer substrate (polyethylene terephthalate, 125-μm thickness) was conducted and analyzed. According to the experimental results, torsional bending causes wear-out type failures in conductors and the length-to-width (LTW) ratio of the sample’s substrate was observed to have a significant impact on reliability. If the LTW ratio is smaller than 3, the lifetime of printed conductor seems to collapse and samples lasted for approximately only 17 bending cycles on average. Lifetime was improved by increasing the LTW ratio and samples withstood over hundreds of cycles with LTW ratio of higher than 15. However, the distance of a conductor from the edge of the substrate was not observed to have any significant influence on the reliability under torsional bending.
IEEE transactions on electron devices
|Pages:||2522 - 2528|
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
This work is financially supported by Business Finland funded project (Dnro 3944/31/2014), Academy of Finland’s FIRI funding (grant no. 320017) and European Regional Development Fund’s Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications (grant no. A74080).
|Academy of Finland Grant Number:||
320017 (Academy of Finland Funding decision)
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