University of Oulu

E. Hannila, N. Heinilehto, J. Lauri, K. Keränen and T. Fabritius, "Measuring and modelling the thermal behavior of LEDs in structural electronics," 2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC), Dubrovnik, Croatia, 2020, pp. 1-6, doi: 10.1109/I2MTC43012.2020.9128941

Measuring and modelling the thermal behavior of LEDs in structural electronics

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Author: Hannila, Esa1; Heinilehto, Noora2; Lauri, Janne1;
Organizations: 1Optoelectronics and Measurement Techniques Research Unit, University of Oulu, Oulu, Finland
2Technical Research Centre of Finland Ltd, VTT Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.4 MB)
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Language: English
Published: Institute of Electrical and Electronics Engineers, 2020
Publish Date: 2020-10-05


Structural electronics consists of printed electronics and silicon-based rigid electronics and load-bearing supporting parts of a device (plastic, glass etc.). One interesting example of structural electronics is large area elements in which light emitting diodes (LEDs) are embedded into the glass laminate. LEDs are used as light sources to create i.e. smart surfaces for the architectural and automotive industry. Once the LEDs are embedded into the structure, they undergo the high temperature conditions and stresses, which are known to have an impact on their lifetime. Many of these aspects are not known for structural electronics. In this study, a thermal simulation model for surface mounted LED on polymer substrate was designed in Comsol Multiphysics -simulation software and the validity of it was evaluated with T3ster measurements. According to measurements, the simulation model is accurate and temperature variations between the simulation and the measurement results was less than 1.0 %. Developed model could be used as a basis for designing the structural LED elements and evaluating their performance characteristics in different user cases.

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Series: IEEE International Instrumentation and Measurement Technology Conference
ISSN: 2642-2069
ISSN-E: 2642-2077
ISSN-L: 2642-2069
ISBN: 978-1-7281-4460-3
ISBN Print: 978-1-7281-4461-0
Pages: 1 - 6
Article number: 9128941
DOI: 10.1109/I2MTC43012.2020.9128941
Host publication: 2020 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2020
Conference: IEEE International Instrumentation and Measurement Technology Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: This work is financially supported by Academy of Finland’s FIRI funding (grant no. 320017) and European Regional Development Fund’s Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications (grant no. A74080).
Academy of Finland Grant Number: 320017
Detailed Information: 320017 (Academy of Finland Funding decision)
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