E. Hannila, N. Heinilehto, K. Remes, J. Lauri, K. Keränen and T. Fabritius, "Hybrid Thermal Modeling to Predict LED Thermal Behavior in Hybrid Electronics," in IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 1-10, 2021, Art no. 6001910, doi: 10.1109/TIM.2020.3043112
Hybrid thermal modeling to predict LED thermal behavior in hybrid electronics
|Author:||Hannila, Esa1; Heinilehto, Noora2; Remes, Kari1;|
1Optoelectronics and Measurement Techniques Research Unit, ITEE), University of Oulu, Erkki Koiso-Kanttilan katu 3, 90570 Oulu, Finland
2VTT Technical Research Center of Finland Ltd, Kaitoväylä 1, 90570 Oulu, Finland
|Online Access:||PDF Full Text (PDF, 0.7 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe202101071181
Institute of Electrical and Electronics Engineers,
|Publish Date:|| 2021-01-07
Hybrid structural electronics (HSE) consists of printed electronics, conventional rigid electronics, and load-bearing supporting parts of a device (plastic, glass etc.). Extra-large area and flexible lighting elements with embedded light-emitting diodes (LEDs) are an example of such applications. LEDs can be used, for example, as light sources, to create smart surfaces for the architectural or automotive industry. Once the LEDs are embedded into the structure, they cannot be replaced. To make sustainable HSE products with long lifetime, the new type of designs is needed. The elements of HSE undergo conditions with elevated thermal stresses while in operation. That is known to have an impact on their performance and lifetime, thus making a proper heat management of the LED crucial. Due to the novel additive manufacturing methods, structures, and unconventional material combinations, many thermal management related aspects are not known. In this study, a two-step hybrid method, including thermal modeling and measurements, is used to estimate the thermal behavior of a surface-mounted LED on polymer substrate used in HSE. The model is created and simulated in COMSOL Multiphysics. The validity and accuracy of the model’s thermal behavior are verified through measurements with thermal transient measurements. Based on the experimental verification, the proposed simulation model only has small (less than 2%) temperature variations when compared with measurements. Hence, the developed model can be used as a basis for designing structural LED elements and predicting their performance characteristics in different user cases.
IEEE transactions on instrumentation and measurement
|Pages:||1 - 10|
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
213 Electronic, automation and communications engineering, electronics
This work is financially supported by Business Finland funded project (Dnro 3944/31/2014), Academy of Finland’s FIRI funding (grant no. 320017) and European Regional Development Fund’s Novel Digitally Fabricated Materials for Electronics, Optics and Medical Applications (grant no. A74080).
|Academy of Finland Grant Number:||
320017 (Academy of Finland Funding decision)
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