University of Oulu

Joseph, N., Varghese, J. & Sebastian, M.T. PVDF-SIC Composite Thick Films an Effective ESD Composition for Growing Anti-static Applications. Journal of Elec Materi 49, 1638–1645 (2020).

PVDF-SIC composite thick films an effective ESD composition for growing anti-static applications

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Author: Joseph, Nina1,2; Varghese, Jobin1,2; Sebastian, Mailadil Thomas1,2
Organizations: 1Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, Finland, P.O. Box 4500, FI-90014
2Functional Materials Group, Materials Science & Technology Division, CSIR NIIST, Thiruvananthapuram, Kerala, India 695 019
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1.3 MB)
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Language: English
Published: Springer Nature, 2020
Publish Date: 2021-03-01


Thin polyvinylidene fluoride-silicon carbide (PVDF-SiC) shielding composite films were prepared by a simple solution casting process. X-ray diffraction (XRD) and scanning electron microscopy (SEM) show the presence of both polymer and filler with no reaction between them. The coefficient of thermal expansion (CTE) and tensile strength of the composite exhibit a decreasing tendency, while that of conductivity and electromagnetic interference (EMI) shielding values increase with filler loading. The εr, and tanδ of the composites were also found to increase with filler loading in the frequency range of 8.2—18 GHz, which also influence the shielding behaviour of the composite. The high filler (60 vol.% of SiC) loaded composite of 1 mm thickness exhibits direct current (DC) conductivity of the order of 10-5 S/m indicating its potential for electrostatic discharge shielding applications. This is further confirmed from its EMI SE value of 12 dB, which corresponds 94% attenuation. The composite exhibits a partially reflecting and absorbing shielding nature, without any dominant shielding mechanism. The alternating current (AC) conductivity and skin depth value of the composites exhibit an inverse relationship with each other and influence the shielding thickness. The attenuating power of the PVDF-SiC composite with 60 volume % (vol.%) silicon carbide (SiC) changes from 84% to 99%, with an increase in sample thickness from 0.5 mm to 2 mm. Hence, thin and flexible paper-like EMI shield of PVDF-SiC composite can be easily prepared by simple, cost-effective approach for various shielding applications like electrostatic discharge shielding as well as EMI shielding.

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Series: Journal of electronic materials
ISSN: 0361-5235
ISSN-E: 1543-186X
ISSN-L: 0361-5235
Volume: 49
Issue: 3
Pages: 1638 - 1645
DOI: 10.1007/s11664-019-07538-3
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
213 Electronic, automation and communications engineering, electronics
Copyright information: © 2019 The Minerals, Metals & Materials Society. This is a post-peer-review, pre-copyedit version of an article published in Journal of Electronic Materials. The final authenticated version is available online at: