University of Oulu

K. Rasilainen, T. M. J. Nilsson, J. Bremer, M. Thorsell and C. Fager, "Thermal Analysis of GaN/SiC-on-Si Assemblies: Effect of Bump Pitch and Thickness of SiC Layer," 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2020, pp. 249-253, doi: 10.1109/THERMINIC49743.2020.9420503

Thermal analysis of GaN/SiC-on-Si assemblies : effect of bump pitch and thickness of SiC layer

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Author: Rasilainen, Kimmo1,2; Nilsson, Torbjörn M. J.1,3; Bremer, Johan1;
Organizations: 1Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden
2Centre for Wireless Communications, University of Oulu, Oulu, Finland
3Saab AB, Gothenburg, Sweden
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 1.2 MB)
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Language: English
Published: Institute of Electrical and Electronics Engineers, 2021
Publish Date: 2021-05-31


The ever-increasing requirements for high device performance and compact size drive the communications industry to lookfor new materials, technologies, and integration concepts. This simulation-based study investigates the thermal properties of a compact, heterogeneously integrated gallium nitride on silicon carbide (GaN-on-SiC) and silicon (Si) assembly. Thermal simulations and parametric studies are used to determine how the heat spreading and temperature levels in the lateral and vertical directions are affected by the thickness of the SiC layer and the distribution of the thermal interconnects. Results show that a SiC layer thinned down to 100 µm shows more pronounced differences in its thermal characteristics compared to thicker ones, especially in terms of its backside heating. Aspects related to practical implementations are also considered.

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Series: International Workshop on Thermal Investigation of ICs and Systems
ISSN: 2474-1523
ISSN-L: 2474-1523
ISBN: 978-1-7281-7643-7
ISBN Print: 978-1-7281-7644-4
Pages: 249 - 253
DOI: 10.1109/THERMINIC49743.2020.9420503
Host publication: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Conference: Thermal Investigations of ICs and Systems (THERMINIC)
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: This work was supported by the strategic innovation programme “Smarter Electronic Systems”, a joint effort by the Swedish Government Agency for Innovation Systems (VINNOVA), Formas, and the Swedish Energy Agency, through decision number 2017–01898. The authors would like to thank Mr. P. Ingelhag and Dr. P. Melin from Ericsson AB, Sweden, for providing suitable bump dimensions.
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