Tolvanen, J., Nelo, M., Hannu, J., Juuti, J., Jantunen, H., All-Around Universal and Photoelastic Self-Healing Elastomer with High Toughness and Resilience. Adv. Sci. 2021, 8, 2103235. https://doi.org/10.1002/advs.202103235
All-around universal and photoelastic self-healing elastomer with high toughness and resilience
|Author:||Tolvanen, Jarkko1; Nelo, Mikko1; Hannu, Jari1;|
1Microelectronics Research Unit Faculty of Information Technology and Electrical Engineering University of Oulu P.O. Box 4500, Oulu FIN-90014, Finland
|Online Access:||PDF Full Text (PDF, 9.8 MB)|
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2021102252046
John Wiley & Sons,
|Publish Date:|| 2021-10-22
Ultimately soft electronics seek affordable and high mechanical performance universal self-healing materials that can autonomously heal in harsh environments within short times scales. As of now, such features are not found in a single material. Herein, interpenetrated elastomer network with bimodal chain length distribution showing rapid autonomous healing in universal conditions (<7200 s) with high efficiency (up to 97.6 ± 4.8%) is reported. The bimodal elastomer displays strain-induced photoelastic effect and reinforcement which is responsible for its remarkable mechanical robustness (≈5.5 MPa stress at break and toughness ≈30 MJ m−3). The entropy-driven elasticity allows an unprecedented shape recovery efficiency (100%) even after fracturing and 100% resiliency up to its stretching limit (≈2000% strain). The elastomers can be mechanically conditioned leading to a state where they recover their shape extremely quickly after removal of stress (nearly order of magnitude faster than pristine elastomers). As a proof of concept, universal self-healing mechanochromic strain sensor is developed capable of operating in various environmental conditions and of changing its photonic band gap under mechanical stress.
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
216 Materials engineering
The research was financially supported by the ENTITY project (Infotech Oulu, University of Oulu), iMATU project (MATINE, Finland), and the Printed Intelligence Infrastructure (Academy of Finland, grant no. 320017). J.J. and N.M. acknowledge funding of Academy of Finland (decision number 318203). The authors gratefully acknowledge Dr. Lassi Rieppo and Tuomo Siponkoski for their help with FTIR measurements and thermal property characterization, respectively.
|Academy of Finland Grant Number:||
320017 (Academy of Finland Funding decision)
318203 (Academy of Finland Funding decision)
©2021 The Authors. Advanced Science published by Wiley-VCH GmbH. This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.