University of Oulu

ACS Appl. Mater. Interfaces 2021, 13, 41, 49301–49312

Bioplastics and Carbon-Based Sustainable Materials, Components, and Devices : Toward Green Electronics

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Author: Bozó, Éva1; Ervasti, Henri1; Hosseini Shokouh, Seyed Hossein1;
Organizations: 1Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, FI-90570 Oulu, Finland
2Department of Applied and Environmental Chemistry and MTA-SZTE Reaction Kinetics and Surface Chemistry Research Group, University of Szeged, Szeged 6720, Hungary
3Proplast - Consorzio per la Promozione della Cultura Plastica, 15122 Alessandria (AL), Italy
4Bio Base Europe Pilot Plant VZW, 9042 Desteldonk (Gent), Belgium
5Tecnopackaging, Polígono Industrial Empresarium, 50720 Zaragoza, Spain
6TECNALIA, Basque Research and Technology Alliance (BRTA), Health Division, Parque Tecnológico de Álava, E-01510 Miñano, Araba, Spain
Format: article
Version: published version
Access: open
Online Access: PDF Full Text (PDF, 8.9 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2021102952867
Language: English
Published: American Chemical Society, 2021
Publish Date: 2021-10-29
Description:

Abstract

The continuously growing number of short-life electronics equipment inherently results in a massive amount of problematic waste, which poses risks of environmental pollution, endangers human health, and causes socioeconomic problems. Hence, to mitigate these negative impacts, it is our common interest to substitute conventional materials (polymers and metals) used in electronics devices with their environmentally benign renewable counterparts, wherever possible, while considering the aspects of functionality, manufacturability, and cost. To support such an effort, in this study, we explore the use of biodegradable bioplastics, such as polylactic acid (PLA), its blends with polyhydroxybutyrate (PHB) and composites with pyrolyzed lignin (PL), and multiwalled carbon nanotubes (MWCNTs), in conjunction with processes typical in the fabrication of electronics components, including plasma treatment, dip coating, inkjet and screen printing, as well as hot mixing, extrusion, and molding. We show that after a short argon plasma treatment of the surface of hot-blown PLA-PHB blend films, percolating networks of single-walled carbon nanotubes (SWCNTs) having sheet resistance well below 1 kΩ/□ can be deposited by dip coating to make electrode plates of capacitive touch sensors. We also demonstrate that the bioplastic films, as flexible dielectric substrates, are suitable for depositing conductive micropatterns of SWCNTs and Ag (1 kΩ/□ and 1 Ω/□, respectively) by means of inkjet and screen printing, with potential in printed circuit board applications. In addition, we exemplify compounded and molded composites of PLA with PL and MWCNTs as excellent candidates for electromagnetic interference shielding materials in the K-band radio frequencies (18.0—26.5 GHz) with shielding effectiveness of up to 40 and 46 dB, respectively.

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Series: ACS applied materials & interfaces
ISSN: 1944-8244
ISSN-E: 1944-8252
ISSN-L: 1944-8244
Volume: 13
Issue: 41
Pages: 49301 - 49312
DOI: 10.1021/acsami.1c13787
OADOI: https://oadoi.org/10.1021/acsami.1c13787
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
Subjects:
Funding: This study was partly funded by Business Finland (project 1212/31/2020, All green structural electronics), EU Horizon2020-BBI JU (project 792261, NewPack), and EU Interreg Nord-Lapin liitto (project 20201468, Flexible transparent conductive f ilms as electrodes) and Academy of Finland (project 316825, Nigella). The authors thank Dr. Mikko Nelo (Univ. Oulu) and the personnel of the Centre for Material Analysis (Univ. Oulu) for the technical assistance. They are also grateful for the Cellunolix lignin samples provided by St1 Finland.
Copyright information: © 2021 The Authors. Published by American Chemical Society. Published under a Creative Commons Attribution License.
  https://creativecommons.org/licenses/by/4.0/