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K. Rasilainen et al., "Characterisation of RF Connectors and Components for Advanced 5G Applications," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, pp. 942-948, doi: 10.1109/ECTC51906.2022.00153.

Characterisation of RF connectors and components for advanced 5G applications

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Author: Rasilainen, Kimmo1; Leinonen, Marko E.1; Kursu, Olli1;
Organizations: 1Centre for Wireless Communications, University of Oulu, Finland
2ExcellAnt Oy, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 5 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2022083056775
Language: English
Published: Institute of Electrical and Electronics Engineers, 2022
Publish Date: 2022-08-12
Description:

Abstract

Development of 5G and beyond technologies brings wireless communications systems to operate at higher frequencies and makes them more compact and integrated in nature. This places further challenges for component and system design, but at the same time the need for reliable RF interconnections becomes more and more important. This work investigates passive RF structures implemented on a low-permittivity Panasonic dielectric substrate up to a frequency of 110 GHz with simulations and measurements. Two different test cases are considered: a simple transmission line with a TRL calibration structure as well as a Wilkinson power divider. Agreement between simulations and measurements is rather good, and the results show that the used substrate material is a viable alternative for RF applications around 100 GHz.

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Series: Proceedings. Electronic Components Conference
ISSN: 0569-5503
ISSN-E: 2377-5726
ISSN-L: 0569-5503
Pages: 942 - 948
DOI: 10.1109/ECTC51906.2022.00153
OADOI: https://oadoi.org/10.1109/ECTC51906.2022.00153
Host publication: IEEE 72nd Electronic Components and Technology Conference, ECTC 2022 : proceedings
Conference: IEEE Electronic Components and Technology Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
5G
Wilkinson power divider
connector
dielectric substrate
millimetre wave
transmission line
Article
Funding: This work was supported by the Academy of Finland through the 6Genesis Flagship programme (grant no. 318927). The authors gratefully acknowledge Panasonic Corp. for providing the suitable material. Keysight Inc. has supported the research by donating measurement equipment.
Academy of Finland Grant Number: 318927
Detailed Information: 318927 (Academy of Finland Funding decision)
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