University of Oulu

Tolvanen, J., Nelo, M., Alasmäki, H., Siponkoski, T., Mäkelä, P., Vahera, T., Hannu, J., Juuti, J., Jantunen, H., Ultraelastic and High-Conductivity Multiphase Conductor with Universally Autonomous Self-Healing. Adv. Sci. 2022, 9, 2205485.

Ultraelastic and high-conductivity multiphase conductor with universally autonomous self-healing

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Author: Tolvanen, Jarkko1; Nelo, Mikko1; Alasmäki, Heidi1;
Organizations: 1Microelectronics Research Unit, Faculty of Information Technology and Electrical Engineering, University of Oulu, P.O. Box 4500, Oulu, FI-90014 Finland
2Research Unit of Medical Imaging, Physics and Technology, Faculty of Medicine, University of Oulu, P.O. Box 5000, Oulu, FI-90014 Finland
Format: article
Version: published version
Access: open
Online Access: PDF Full Text (PDF, 10.8 MB)
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Language: English
Published: John Wiley & Sons, 2022
Publish Date: 2022-11-15


Next-generation, truly soft, and stretchable electronic circuits with material level self-healing functionality require high-performance solution-processable organic conductors capable of autonomously self-healing without external intervention. A persistent challenge is to achieve required performance level as electrical, mechanical, and self-healing properties optimized in tandem are difficult to attain. Here heterogenous multiphase conductor with cocontinuous morphology and macroscale phase separation for ultrafast universally autonomous self-healing with full recovery of pristine tensile and electrical properties in less than 120 and 900 s, respectively, is reported. The multiphase conductor is insensitive to flaws under stretching and achieves a synergistic combination of conductivity up to ≈1.5 S cm−1, stress at break ≈4 MPa, toughness up to >81 MJ m−3, and elastic recovery exceeding 2000% strain. Such properties are difficult to achieve simultaneously with any other type of material so far. The solution-processable multiphase conductor offers a paradigm shift for damage tolerant and environmentally resistant soft electronic components and circuits with material level self-healing.

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Series: Advanced science
ISSN: 2198-3844
ISSN-E: 2198-3844
ISSN-L: 2198-3844
Volume: 9
Issue: 36
Article number: 2205485
DOI: 10.1002/advs.202205485
Type of Publication: A1 Journal article – refereed
Field of Science: 216 Materials engineering
Funding: The research was financially supported by the ENTITY project (Infotech Oulu, University of Oulu), iMATU project (MATINE, Finland) and Printed Intelligence Infrastructure (Academy of Finland, Grant No. 320017). M.N. acknowledges funding from focus area spearhead project (Infotech Oulu, University of Oulu). J.J. and M.N. acknowledge funding of Academy of Finland (Decision No. 318203). H.A. acknowledges funding of Jenny and Antti Wihuri Foundation. The authors gratefully acknowledge Dr. Yang Bai and Dr. Aldeliane Maria da Silva for their technical assistance with UV–Vis–NIR and AFM, respectively.
Academy of Finland Grant Number: 320017
Detailed Information: 320017 (Academy of Finland Funding decision)
318203 (Academy of Finland Funding decision)
Copyright information: © 2022 The Authors. Advanced Science published by Wiley-VCH GmbH.This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.