University of Oulu

J. Rusanen et al., "Ka-Band Orthogonal Load-Modulated Balanced Amplifier in 22 nm CMOS FDSOI," 2022 17th European Microwave Integrated Circuits Conference (EuMIC), 2022, pp. 161-164, doi: 10.23919/EuMIC54520.2022.9923540.

Ka-band orthogonal load-modulated balanced amplifier in 22 nm CMOS FDSOI

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Author: Rusanen, Jere1; Sethi, Alok1; Tervo, Nuutti1;
Organizations: 1Department of Information Technology and Electrical Engineering, University of Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.6 MB)
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Language: English
Published: Institute of Electrical and Electronics Engineers, 2022
Publish Date: 2022-12-08


An integrated orthogonal load-modulated balanced amplifier (OLMBA) is designed and fabricated using 22 nm CMOS FDSOI. The input control signal in OLMBA is reflected back to balanced power amplifier (PA) pair via reactively terminated quadrature hybrid at the output in order to achieve load modulation. The proposed PA operates at third generation partnership project/new radio (3GPP/NR) 26/28 GHz Frequency Range 2 (FR2), achieving 19.5 dBm output power, 16.6 dB gain, 15.7% power added efficiency (PAE) and 18.3 dBm output 1-dB compression point (P1dB), measured at 26 GHz. The PA shows excellent linearity performance with modulated signals. Using -28 dBc adjacent channel leakage ratio (ACLR) and -21.9 dB (8%) error vector magnitude as threshold values, the proposed PA achieves 11.4 dBm and 4.9 dBm average output power (Pavg) with 100 MHz and 400 MHz 64-QAM 3GPP/NR FR2 signal, and 14 dBm Pavg with 0.6 Gb/s (120 MHz) single carrier (SC) 64-QAM signal, measured at 26 GHz.

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ISBN: 978-2-87487-070-5
ISBN Print: 978-1-6654-5880-1
Pages: 161 - 164
DOI: 10.23919/eumic54520.2022.9923540
Host publication: 2022 17th European microwave integrated circuits conference (EuMIC)
Conference: European Microwave Integrated Circuits Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Funding: This research has been financially supported by Infotech Oulu and Academy of Finland research projects MIMEPA (grant 323779) and 6G Flagship (grant 346208). GLOBALFOUNDRIES is acknowledged for silicon processing and technical support. Author Jere Rusanen would like to thank Seppo Säynäjäkangas Science Foundation and Foundation of Riitta and Jorma J. Takanen for personal grants.
Academy of Finland Grant Number: 323779
Detailed Information: 323779 (Academy of Finland Funding decision)
346208 (Academy of Finland Funding decision)
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