University of Oulu

B. M. Mohammed et al., "Fabrication of a Wearable Antenna with Defected Ground Structure on a Flexible TPU-Polyester Substrate," 2022 IEEE International RF and Microwave Conference (RFM), Kuala Lumpur, Malaysia, 2022, pp. 1-4, doi: 10.1109/RFM56185.2022.10064780

Fabrication of a wearable antenna with defected ground structure on a flexible TPU-polyester substrate

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Author: Mohammed, Badr Mohseh1; Al-Hadi, Azremi Abdullah1; Azemi, Saidatul Norlyana1;
Organizations: 1Advanced Communication Engineering Center of Excellence, Faculty of Electronic Engineering & Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia
2Manufacturing Technology & Innovation Department, Jabil Circuits Sdn. Bhd., Penang, Malaysia
3Centre for Wireless Communications (CWC), University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.6 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2023041436615
Language: English
Published: IEEE, 2022
Publish Date: 2023-04-14
Description:

Abstract

This work presents a patch antenna with defected ground structure (DGS) on flexible materials for wearable applications. It is fed a 50 Ω inset feed and designed for operation at 2.45 GHz on a thermoplastic polyurethane-polyester fabric substrate. The DGS are integrated to ensure a compact design and improved bandwidth, efficiency, and gain. Simulations indicated that the antenna bandwidth is enhanced from 28.4 MHz without DGS to 79.3 MHz. Besides that, its gain is also improved from 2.01 dBi without DGS to 3.62 dBi and efficiency from 30% to 74%. Both antenna designs are fabricated and measured and provide good results and performance with efficiency greater than 50%.

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ISBN: 978-1-6654-8977-5
ISBN Print: 978-1-6654-8978-2
DOI: 10.1109/rfm56185.2022.10064780
OADOI: https://oadoi.org/10.1109/rfm56185.2022.10064780
Host publication: 2022 IEEE International RF and Microwave Conference (RFM)
Conference: IEEE International RF and Microwave Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
Funding: The authors would like to acknowledge the support from University-Private Matching Fund (UniPRIMA) under grants number of 9001-0064/9002-00125 and 9001-00645/9002-00126 from Universiti Malaysia Perlis and Jabil Circuits Sdn. Bhd.
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