University of Oulu

S. Afroz et al., "Dual Band Circular Patch Flexible Wearable Antenna Design for Sub-6 GHz 5G Applications," 2022 IEEE International RF and Microwave Conference (RFM), Kuala Lumpur, Malaysia, 2022, pp. 1-4, doi: 10.1109/RFM56185.2022.10065238

Dual band circular patch flexible wearable antenna design for sub-6 GHz 5G applications

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Author: Afroz, Sadia1; Al-Hadi, Azremi Abdullah1; Azemi, Saidatul Norlyana1;
Organizations: 1Advanced Communication Engineering Center of Excellence, Faculty of Electronic Engineering & Technology, Universiti Malaysia Perlis, Arau, Perlis, Malaysia
2Manufacturing Technology & Innovation Department, Jabil Circuits Sdn. Bhd, Penang, Malaysia
3Centre for Wireless Communications (CWC), University of Oulu, Oulu, Finland
Format: article
Version: accepted version
Access: open
Online Access: PDF Full Text (PDF, 0.4 MB)
Persistent link: http://urn.fi/urn:nbn:fi-fe2023041436638
Language: English
Published: IEEE, 2022
Publish Date: 2023-04-14
Description:

Abstract

In this paper, a dual band wearable antenna for 5G applications that resonates at 3.63 GHz and 4.95 GHz covering sub-6 GHz 5G-NR bands such as n48, n77, n78, and n79 is presented. The antenna consists of slotted circular ring patch as radiating element, polyester as wearable substrate, and a partial ground plane on the bottom. The designed antenna is sized at 55×46×0.4 mm³, achieving a bandwidth of 300 MHz from 3.50 to 3.80 GHz and a bandwidth of 160 MHz from 4.86 to 5.02 GHz. Besides, the antenna shows realized gain of 4.2 dBi at 3.63 GHz and 5.78 dBi at 4.95 GHz, whereas efficiency is found 90.5 % and 82.3 % respectively.

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ISBN: 978-1-6654-8977-5
ISBN Print: 978-1-6654-8978-2
DOI: 10.1109/rfm56185.2022.10065238
OADOI: https://oadoi.org/10.1109/rfm56185.2022.10065238
Host publication: 2022 IEEE International RF and Microwave Conference (RFM)
Conference: IEEE International RF and Microwave Conference
Type of Publication: A4 Article in conference proceedings
Field of Science: 213 Electronic, automation and communications engineering, electronics
Subjects:
Funding: The authors would like to acknowledge the support from University-Private Matching Fund (UniPRIMA) under grants number of 9001-0064/9002-00125 and 9001-00645/9002-00126 from Universiti Malaysia Perlis and Jabil Circuits Sdn. Bhd.
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