Yi Xiong, Tian Zhou, Zheng-ge Chen, Yong-li Wu, Xiao-qin Zha, Yong Li, Shu-bo Wang, Harishchandra Singh, Marko Huttula & Wei Cao (2023) Laser shock peening rounds influencing microstructural and mechanical properties of 300M steel, Materials Science and Technology, DOI: 10.1080/02670836.2023.2196472
Laser shock peening rounds influencing microstructural and mechanical properties of 300M steel
|Author:||Xiong, Yi1,2; Zhou, Tian3; Chen, Zheng-ge4;|
1School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, People’s Republic of China
2Collaborative Innovation Center of New Nonferrous Metal Materials and Advanced Processing Technology Jointly Established by the Ministry of Science and Technology, Luoyang, People’s Republic of China
3School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, People’s Republic of China
4State Key Laboratory of Laser Interaction with Matter, Northwest Institute of Nuclear Technology, Xi’an, People’s Republic of China
5Luoyang Ship Material Research Institute, Luoyang, People’s Republic of China
6Central Iron and Steel Research Institute, Beijing, People’s Republic of China
7Nano and Molecular Systems Research Unit, University of Oulu, Oulu, Finland
|Persistent link:|| http://urn.fi/urn:nbn:fi-fe2023041937550
|Publish Date:|| 2024-04-04
Laser shock peeing (LSP) was introduced to produce surface gradient structures on 300M steel to improve its performance, service life and related workpiece safety. The influences of LSP rounds on microstructural and mechanical properties were investigated to optimise the LSP processing. Smoother surface, surface nanocystallization, and gradient structure, hardness, compressive residue stress was observed LSP. Strength and plasticity of 300M steel improved significantly due to the surface changes induced by one round of LSP. However, excessive LSP rounds tend to deteriorate the surface roughness and mechanical properties despite increased surface nanocrystallization, hardening zone depth and compressive residual stress.
Materials science and technology
|Type of Publication:||
A1 Journal article – refereed
|Field of Science:||
113 Computer and information sciences
213 Electronic, automation and communications engineering, electronics
This work was supported by National Natural Science Foundation of China: [Grant Number U1804146]; National Natural Science Foundation of China: [Grant Number 51905153]; National Natural Science Foundation of China: [Grant Number 52111530068]; Academy of Finland: [Grant Number 311934]; Education Department of Henan Province: [Grant Number 16A430005]; Science and Technology Innovation Team of Henan University of Science and Technology: [Grant Number 2015XTD006]; Foreign Experts Introduction Project of Henan Province: [Grant Number HNGD2020009]; Program for Science, Technology Innovation Talents in Universities of Henan Province: [Grant Number 17HASTIT026].
|Academy of Finland Grant Number:||
311934 (Academy of Finland Funding decision)
This is an Accepted Manuscript of an article published by Taylor & Francis in Materials Science and Technology on 04 Apr 2023, available online: https://doi.org/10.1080/02670836.2023.2196472. It is deposited under the terms of the Creative Commons Attribution-NonCommercial License (http://creativecommons.org/licenses/by-nc/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is properly cited.