|
|
Gluing joint methods and quality assurance in electronics industry |
|---|---|
| Author: | Säippä, Kalle1 |
| Organizations: |
1University of Oulu, Faculty of Technology, Department of Electrical Engineering, Electrical Engineering |
| Format: | ebook |
| Version: | published version |
| Access: | restricted |
| Theses with restricted access are only available for reading on the e-thesis workstations. | |
| Pages: | 60 |
| Persistent link: | http://urn.fi/URN:NBN:fi:oulu-201305131239 |
| Language: | English |
| Published: |
Oulu :
K. Säippä,
2013
|
| Publish Date: | 2013-05-15 |
| Thesis type: | Master's thesis (tech) |
| Tutor: |
Röning, Juha |
| Reviewer: |
Röning, Juha Hietakangas, Simo |
| Subjects: | |
| Copyright information: |
© Kalle Säippä, 2013. This publication is copyrighted. You may download, display and print it for your own personal use. Commercial use is prohibited. |