RF system model for In-band full duplex communications
1University of Oulu, Faculty of Information Technology and Electrical Engineering, Communications Engineering
|Online Access:||PDF Full Text (PDF, 1.5 MB)|
|Persistent link:|| http://urn.fi/URN:NBN:fi:oulu-201612103223
|Publish Date:|| 2016-12-12
|Thesis type:||Master's thesis
In recent years by increasing the demands for communication services various technologies are examined in order to improve the throughput and spectrum efficiency of the wireless communication systems. For improving the performance a communication network, system deficiencies such as transmitter and receiver impairments need to be removed or compensated. One way to improve the network efficiency is to employ full duplex technology. Full duplex technology doubles the network capacity compared to the case when typical frequency division duplexing (FDD) or time division duplexing (TDD) are employed in a transceiver design.
Although full duplex (FD) technology has enhanced the performance of the radio communication devices, the main challenge in full duplex communication is the leaking self-interference signal from the transmitter to the receiver. Different methods are employed to suppress the self-interference signal in digital and analog domains which are categorized as passive or active cancellations. These techniques are discussed in this thesis in order to understand from which point in the propagation path, the required signal for cancellation can be taken and how those techniques are employed in digital and analog domains. For having a good self-interference cancellation (SIC) both analog and digital cancellation techniques are needed since typical digital suppression method is low complex and somewhat limited.
In this thesis, first we start with discussing about the full duplex technology and the reason why it has become popular in recent years and later full duplex deficiencies are examined. In the following chapters different cancellation methods are introduced and some results are provided in Chapter 5.
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